DSPIC30F3013-30I/SO Microchip Technology, DSPIC30F3013-30I/SO Datasheet - Page 4
![IC DSPIC MCU/DSP 24K 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
DSPIC30F3013-30I/SO
Manufacturer Part Number
DSPIC30F3013-30I/SO
Description
IC DSPIC MCU/DSP 24K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(210 pages)
2.DSPIC30F2011-20ISO.pdf
(6 pages)
3.DSPIC30F3012-20ISO.pdf
(14 pages)
4.DSPIC30F3012-20ISO.pdf
(20 pages)
5.DSPIC30F3014-30IP.pdf
(244 pages)
Specifications of DSPIC30F3013-30I/SO
Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
20
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
30
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F301330ISO
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F3013-30I/SO
Manufacturer:
NSC
Quantity:
340
Part Number:
DSPIC30F3013-30I/SO
Manufacturer:
PIC
Quantity:
20 000
dsPIC30F3012/3013
Silicon Errata Issues
1. Module: CPU
DS80448D-page 4
Note:
Sequential MAC class instructions, which prefetch
data from Y data space using ±4 address
modification cause an address error trap. The trap
occurs only when all the following conditions are
true:
1. Two sequential MAC class instructions (or a
2. Both instructions prefetch data from Y data
3. Neither of the instruction uses an accumulator
Work around
The problem described above can be avoided by
using any of the following methods:
1. Inserting any other instruction between the two
2. Adding an accumulator write back (a dummy
3. Do not use the + = 4 or - = 4 address
4. Do not prefetch data from Y data space.
Affected Silicon Revisions
B0
X
MAC class instruction executed in a REPEAT or
DO loop) that prefetch from Y data space.
space using the + = 4 or - = 4 address
modification.
write back.
MAC class instructions.
write back if needed) to either of the MAC class
instructions.
modification.
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated by the shaded column in
the following tables apply to the current
silicon revision (B1).
B1
X
2. Module: CPU
EXAMPLE 1:
L0:DAW.b
L1: ....
The Decimal Adjust instruction, DAW.b, may
improperly clear the Carry bit, C (SR<0>), when
executed.
Work around
Check the Carry bit status before executing the
DAW.b instruction. If the Carry bit is set, set the
Carry bit again after executing the DAW.b
instruction. Example 1 shows how the application
should process the Carry bit during a BCD addition
operation.
Affected Silicon Revisions
B0
.include “p30f3013.inc”
.......
MOV.b
MOV.b
ADD.b
BRA
DAW.b
BSET.b SR, #C
BRA
X
B1
X
#0x80, w0
#0x80, w1
w0, w1, w2 ;Perform addition
NC, L0
w2
L1
w2
CHECK CARRY BIT BEFORE
DAW.b
© 2010 Microchip Technology Inc.
;First BCD number
;Second BCD number
;If C set go to L0
;If not,do DAW and
;set the carry bit
;and exit