PIC18LF2410-I/SO Microchip Technology, PIC18LF2410-I/SO Datasheet - Page 357
![IC MCU FLASH 8KX16 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC18LF2410-I/SO
Manufacturer Part Number
PIC18LF2410-I/SO
Description
IC MCU FLASH 8KX16 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18LF2410-ISO.pdf
(376 pages)
2.PIC18LF2410-ISO.pdf
(8 pages)
3.PIC18LF2410-ISO.pdf
(16 pages)
4.PIC18LF2410-ISO.pdf
(6 pages)
5.PIC18LF2410-ISO.pdf
(6 pages)
6.PIC18LF2410-ISO.pdf
(8 pages)
Specifications of PIC18LF2410-I/SO
Core Size
8-Bit
Program Memory Size
16KB (8K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC18
No. Of I/o's
25
Ram Memory Size
768Byte
Cpu Speed
40MHz
No. Of Timers
4
Interface
I2C, SPI, USART
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18LF2410-I/SO
Manufacturer:
TOSHIBA
Quantity:
3 000
- PIC18LF2410-ISO PDF datasheet
- PIC18LF2410-ISO PDF datasheet #2
- PIC18LF2410-ISO PDF datasheet #3
- PIC18LF2410-ISO PDF datasheet #4
- PIC18LF2410-ISO PDF datasheet #5
- PIC18LF2410-ISO PDF datasheet #6
- Current page: 357 of 376
- Download datasheet (7Mb)
© 2009 Microchip Technology Inc.
44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
A1
Dimension Limits
1
2
E
EXPOSED
A
NOTE 1
Units
D2
A1
A3
E2
N
A
E
D
K
e
b
L
PAD
E2
1
2
MIN
0.80
0.00
6.30
6.30
0.25
0.30
0.20
PIC18F2X1X/4X1X
N
MILLIMETERS
0.65 BSC
8.00 BSC
8.00 BSC
0.20 REF
BOTTOM VIEW
NOM
0.90
0.02
6.45
6.45
0.30
0.40
44
Microchip Technology Drawing C04-103B
–
D2
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
–
DS39636D-page 359
K
e
b
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