DSPIC30F3012-30I/P Microchip Technology, DSPIC30F3012-30I/P Datasheet - Page 14

• Manufacturer Part Number: DSPIC30F3012-30I/P
• Description: IC DSPIC MCU/DSP 24K 18DIP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3012-30I/P

• Program Memory Type: FLASH
• Program Memory Size: 24KB (8K x 24)
• Package / Case: 18-DIP (0.300", 7.62mm)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 12
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 12
• Data Ram Size: 2 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC30F005 - MODULE SCKT DSPIC30F 18DIP/SOICDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLEACICE0202 - ADAPTER MPLABICE 18P 300 MIL
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F3012-30IP

dsPIC30F
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On-Line Support................................................................................................................................................................................. 239
Systems Information and Upgrade Hot Line ...................................................................................................................................... 239
Reader Response .............................................................................................................................................................................. 240
Product Identification System............................................................................................................................................................. 241
DS70082G-page 12
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Device Overview .................................................................................................................................................................... 13
CPU Architecture Overview.................................................................................................................................................... 19
Memory Organization ............................................................................................................................................................. 31
Address Generator Units........................................................................................................................................................ 43
Interrupts ................................................................................................................................................................................ 51
Flash Program Memory.......................................................................................................................................................... 57
Data EEPROM Memory ......................................................................................................................................................... 63
I/O Ports ................................................................................................................................................................................. 67
Timer1 Module ....................................................................................................................................................................... 73
Timer2/3 Module .................................................................................................................................................................... 77
Timer4/5 Module ................................................................................................................................................................... 83
Input Capture Module............................................................................................................................................................. 87
Output Compare Module ........................................................................................................................................................ 91
Quadrature Encoder Interface (QEI) Module ......................................................................................................................... 95
Motor Control PWM Module ................................................................................................................................................. 101
SPI™ Module ....................................................................................................................................................................... 111
I2C Module ........................................................................................................................................................................... 115
Universal Asynchronous Receiver Transmitter (UART) Module .......................................................................................... 123
CAN Module ......................................................................................................................................................................... 131
10-bit High Speed Analog-to-Digital Converter (A/D) Module .............................................................................................. 143
System Integration ............................................................................................................................................................... 151
Instruction Set Summary ...................................................................................................................................................... 165
Development Support........................................................................................................................................................... 173
Electrical Characteristics ...................................................................................................................................................... 179
Packaging Information.......................................................................................................................................................... 221
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