DSPIC30F2010-20I/SO Microchip Technology, DSPIC30F2010-20I/SO Datasheet - Page 14
![IC DSPIC MCU/DSP 12K 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
DSPIC30F2010-20I/SO
Manufacturer Part Number
DSPIC30F2010-20I/SO
Description
IC DSPIC MCU/DSP 12K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2010-20ISO.pdf
(202 pages)
3.DSPIC30F2010-20ISO.pdf
(18 pages)
4.DSPIC30F2010-20ISO.pdf
(6 pages)
5.DSPIC30F2010-20ISO.pdf
(26 pages)
6.DSPIC30F2010-20IMM.pdf
(204 pages)
Specifications of DSPIC30F2010-20I/SO
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
20
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
20
Flash Memory Size
12KB
Supply Voltage Range
2.5V To 5.5V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
DSPIC30F2010-20I/SOG
DSPIC30F201020IS
DSPIC30F201020IS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F2010-20I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F2010-20ISO PDF datasheet #2
- DSPIC30F2010-20ISO PDF datasheet #3
- DSPIC30F2010-20ISO PDF datasheet #4
- DSPIC30F2010-20ISO PDF datasheet #5
- DSPIC30F2010-20IMM PDF datasheet #6
- Current page: 14 of 204
- Download datasheet (3Mb)
dsPIC30F2010
2.3
The dsPIC DSC devices feature a 16/16-bit signed
fractional divide operation, as well as 32/16-bit and 16/
16-bit signed and unsigned integer divide operations, in
the form of single instruction iterative divides. The
following instructions and data sizes are supported:
• DIVF – 16/16 signed fractional divide
• DIV.sd – 32/16 signed divide
• DIV.ud – 32/16 unsigned divide
• DIV.sw – 16/16 signed divide
• DIV.uw – 16/16 unsigned divide
The 16/16 divides are similar to the 32/16 (same number
of iterations), but the dividend is either zero-extended or
sign-extended during the first iteration.
TABLE 2-1:
DS70118H-page 14
DIVF
DIV.sd
DIV.ud
DIV.sw (or DIV.s)
DIV.uw (or DIV.u)
Divide Support
Instruction
DIVIDE INSTRUCTIONS
Signed fractional divide: Wm/Wn → W0; Rem → W1
Signed divide: (Wm + 1:Wm)/Wn → W0; Rem → W1
Unsigned divide: (Wm + 1:Wm)/Wn → W0; Rem → W1
Signed divide: Wm/Wn → W0; Rem → W1
Unsigned divide: Wm/Wn → W0; Rem → W1
The divide instructions must be executed within a
REPEAT loop. Any other form of execution (e.g., a
series of discrete divide instructions) will not function
correctly because the instruction flow depends on
RCOUNT. The divide instruction does not automatically
set up the RCOUNT value, and it must, therefore, be
explicitly and correctly specified in the REPEAT
instruction, as shown in Table 2-1 (REPEAT will execute
the target instruction {operand value + 1} times). The
REPEAT loop count must be set up for 18 iterations of
the DIV/DIVF instruction. Thus, a complete divide
operation requires 19 cycles.
Note:
Function
The Divide flow is interruptible. However,
the user needs to save the context as
appropriate.
© 2008 Microchip Technology Inc.
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