DSPIC30F2012-20I/SO Microchip Technology, DSPIC30F2012-20I/SO Datasheet - Page 148
DSPIC30F2012-20I/SO
Manufacturer Part Number
DSPIC30F2012-20I/SO
Description
IC DSPIC MCU/DSP 12K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20ISO.pdf
(210 pages)
3.DSPIC30F2011-20ISO.pdf
(14 pages)
4.DSPIC30F2011-20ISO.pdf
(6 pages)
5.DSPIC30F2011-20ISO.pdf
(18 pages)
6.DSPIC30F2011-20ISO.pdf
(206 pages)
Specifications of DSPIC30F2012-20I/SO
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
20
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Core Frequency
40MHz
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
20
Flash Memory Size
12KB
Supply Voltage Range
2.5V To 5.5V
Operating Temperature Range
-40°C To +85°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
DSPIC30F201220ISO
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F2012-20I/SO
Manufacturer:
MICROCHI
Quantity:
20 000
dsPIC30F2011/2012/3012/3013
TABLE 20-2:
TABLE 20-3:
TABLE 20-4:
DS70139C-page 146
dsPIC30F201x-30I
dsPIC30F301x-30I
dsPIC30F201x-20I
dsPIC30F301x-20I
dsPIC30F201x-20E
dsPIC30F301x-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 18-pin PDIP (P)
Package Thermal Resistance, 18-pin SOIC (SO)
Package Thermal Resistance, 28-pin SPDIP (SP)
Package Thermal Resistance, 28-pin (SOIC)
Package Thermal Resistance, 44-pin QFN
Note 1:
DC CHARACTERISTICS
Operating Voltage
DC10
DC11
DC12
DC16
DC17
Note 1:
Param
No.
2:
3:
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
P
V
V
V
V
S
I
Symbol
INT
/
Junction to ambient thermal resistance, Theta-ja (
“Typ” column data is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
This is the limit to which V
DD
DD
DR
POR
VDD
O
=
=
∑
V
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DD
V
(2)
Supply Voltage
Supply Voltage
RAM Data Retention Voltage
V
internal Power-on Reset signal)
V
internal Power-on Reset signal)
DD
DD
DD
I
–
D D
Start Voltage (to ensure
Rise Rate (to ensure
V
Characteristic
–
O H
∑
Rating
Characteristic
I
OH
I
OH
DD
+
∑
can be lowered without losing RAM data.
V
O L
I
OL
Preliminary
(3)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
0.05
Min
2.5
3.0
—
—
JA
) numbers are achieved by package simulations.
Typ
V
1.5
—
—
SS
Symbol
Symbol
P
(1)
DMAX
P
T
T
T
T
T
T
JA
JA
JA
JA
JA
A
A
A
D
J
J
J
Max
5.5
5.5
—
—
Min
Typ
-40
-40
-40
-40
-40
-40
44
57
42
49
28
-40°C T
-40°C T
Units
V/ms 0-5V in 0.1 sec
V
V
V
V
(T
© 2005 Microchip Technology Inc.
P
J
INT
Industrial temperature
Extended temperature
0-3V in 60 ms
- T
Max
Typ
A
A
—
—
—
—
—
+ P
A
) /
+85°C for Industrial
+125°C for Extended
I
/
O
Conditions
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+150
+150
+125
Max
Unit
+85
+85
Notes
Unit
°C
°C
°C
°C
°C
°C
W
W
1
1
1
1
1