PIC18F1320-I/SO Microchip Technology, PIC18F1320-I/SO Datasheet - Page 3

• Manufacturer Part Number: PIC18F1320-I/SO
• Description: IC MCU FLASH 4KX16 A/D 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F1320-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 8KB (4K x 16)
• Package / Case: 18-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 16
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 7x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: EUSART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163014, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 7-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

7. Module: EUSART
8. Module: EUSART
9. Module: EUSART
© 2006 Microchip Technology Inc.
The CREN bit may be cleared when the EUSART
completes an auto-baud measurement.
Work around
When the auto-baud measurement is complete,
the CREN bit must be set by firmware.
Date Codes that pertain to this issue:
All engineering and production devices.
If the TXEN bit is set when an auto-baud measure-
ment is completed, the EUSART may transmit an
arbitrary byte.
Work around
Clear the TXEN bit before performing the auto-
baud measurement. When the measurement is
complete, set the TXEN bit.
Date Codes that pertain to this issue:
All engineering and production devices.
The auto-baud measurement may not determine
the correct baud rate if the ABDEN bit is set while
the RB4/RX pin is low.
Work around
If the wake-up function is being used (WUE is set),
wait for the RB4/RX pin to go high following a
Break signal before setting the ABDEN bit.
If the wake-up function is not being used, ensure
that RB4/RX is Idle (high between bytes) before
setting the ABDEN bit.
Date Codes that pertain to this issue:
All engineering and production devices.
10. Module: Data EEPROM
11. Module: Reset
When writing to the data EEPROM, the contents of
the data EEPROM memory may not be written as
expected.
Work around
Either of two work arounds can be used:
1. Before beginning any writes to the data
2. Configure the BOR as enabled (any voltage).
Date Codes that pertain to this issue:
All engineering and production devices.
It has been observed that in certain Reset condi-
tions, including power-up, the first GOTO instruction
at address 0x0000 may not be executed. This
occurrence is rare and affects very few applications.
To determine if your system is affected, test a
statistically significant number of applications across
the operating temperature, voltage and frequency
ranges of the application. Affected systems will
repeatably fail normal testing. Systems not affected
will continue to not be affected over time.
Work around
Insert a NOP instruction at address 0x0000.
Date Codes that pertain to this issue:
All engineering and production devices.
EEPROM, enable the LVD (any voltage) and
wait for the internal voltage reference to
become stable. LVD interrupt requests may be
ignored. Once the LVD voltage reference is
stable, perform all EEPROM writes normally.
When writes have been completed, the LVD
may be disabled.
Select a threshold below V
operation. If V
the device will be held in Brown-out Reset.
PIC18F1220/1320
DD
is below the BOR threshold,
DD
DS80160F-page 3
to allow normal