PIC18F1320-I/SO Microchip Technology, PIC18F1320-I/SO Datasheet

PIC18F1320-I/SO

Manufacturer Part Number

PIC18F1320-I/SO

Description

IC MCU FLASH 4KX16 A/D 18SOIC

Manufacturer

Microchip Technology

Series

PIC® 18Fr

Datasheets

1.PIC16F616T-ISL.pdf (8 pages)

2.PIC18F1220-ISO.pdf (308 pages)

3.PIC18F1220-ISO.pdf (8 pages)

4.PIC18F1220-ISO.pdf (6 pages)

5.PIC18F1220-ISO.pdf (10 pages)

6.PIC18F1220-ISO.pdf (4 pages)

7.PIC18F1320-ISS.pdf (36 pages)

8.PIC18F1220-EP.pdf (310 pages)

Specifications of PIC18F1320-I/SO

Program Memory Type

FLASH

Program Memory Size

8KB (4K x 16)

Package / Case

18-SOIC (7.5mm Width)

Core Processor

PIC

Core Size

8-Bit

Speed

40MHz

Connectivity

UART/USART

Peripherals

Brown-out Detect/Reset, LVD, POR, PWM, WDT

Number Of I /o

Eeprom Size

256 x 8

Ram Size

256 x 8

Voltage - Supply (vcc/vdd)

4.2 V ~ 5.5 V

Data Converters

A/D 7x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C

Processor Series

PIC18F

Core

PIC

Data Bus Width

8 bit

Data Ram Size

256 B

Interface Type

EUSART

Maximum Clock Frequency

40 MHz

Number Of Programmable I/os

Number Of Timers

Operating Supply Voltage

2 V to 5.5 V

Maximum Operating Temperature

+ 85 C

Mounting Style

SMD/SMT

3rd Party Development Tools

52715-96, 52716-328, 52717-734, 52712-325, EWPIC18

Development Tools By Supplier

PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163014, DV164136

Minimum Operating Temperature

- 40 C

On-chip Adc

7-ch x 10-bit

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

For Use With

DVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

PIC18F1320-I/SO

Manufacturer:

MICROCHIP

Quantity:

35 000

Company:

Meier Automation Equipment Co., Limited

Part Number:

PIC18F1320-I/SO

Manufacturer:

MICROCHIP/微芯

Quantity:

20 000

Current page: 1 of 8
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The PIC18F1220/1320 Rev. B1 parts you have received

conform functionally to the Device Data Sheet

(DS39605C), except for the anomalies described below.

All of the issues listed here will be addressed in future

revisions of the PIC18F1220/1320 silicon.

The

PIC18F1220/1320 devices with these Device/Revision

IDs:

1. Module: Core

The Device IDs (DEVID1 and DEVID2) are located at

addresses

configuration space. They are shown in hexadecimal

in the format “DEVID2 DEVID1”.

Part Number

PIC18F1220

PIC18F1320

Certain combinations of code sequence, code

placement, V

the corruption of fetched instructions. A corrupted

instruction fetch will cause the part to execute an

incorrect instruction with unpredictable results.

Microchip cannot predict which combinations of

these conditions will cause this failure.

If this failure mechanism exists in your system, it

should become evident during statistically significant

preproduction testing using your particular code

sequence and placement (the minimum suggested

sample size is 100 units). Preproduction testing

should exercise all the functions of your application

across system variables. Any changes to code

should be tested in the same manner prior to being

implemented.

This issue has not been observed for F

4 MHz with V

meeting both of these conditions, then the failures

are likely not related to this failure mechanism.

Work around

Use the part at or below 4 MHz with V

below 5.25V.

Change the placement of code within program

memory.

Use the next revision of silicon when it becomes

available.

Date Codes that pertain to this issue:

All engineering and production devices.

following

PIC18F1220/1320 Rev. B1 Silicon/Data Sheet Errata

3FFFFEh:3FFFFFh

silicon

, F

up to 5.25V. If failures occur while

00 0111 111

00 0111 110

Device ID

OSC

and temperature may cause

errata

apply

Revision ID

the

00010

PIC18F1220/1320

OSC

only

device’s

up to

at or

2. Module: Data EEPROM

3. Module: Core (DAW Instruction)

EXAMPLE 1:

MOVLW

ADDLW

BTFSC

INCFSZ byte2

DAW

BTFSC

INCFSZ byte2

This is repeated for each DAW instruction.

When reading the data EEPROM, the contents of

the EEDATA register may be corrupted if the RD

bit (EECON1<0>) is set immediately following a

write to the address byte (EEADR). The actual

contents of the data EEPROM remain unaffected.

Work around

Do not set EEADR immediately before the

execution of a read. Write to EEADR at least one

instruction cycle before setting the RD bit. The

instruction between the write to EEADR and the

read can be any valid instruction, including a NOP.

Date Codes that pertain to this issue:

All engineering and production devices.

The DAW instruction may improperly clear the

Carry bit (STATUS<0>) when executed.

Work around

Test the Carry bit state before executing the DAW

instruction. If the Carry bit is set, increment the

next higher byte to be added, using an instruction

such as INCFSZ (this instruction does not affect

any Status flags and will not overflow a BCD nib-

ble). After the DAW instruction has been executed,

process the Carry bit normally (see Example 1).

Date Codes that pertain to this issue:

All engineering and production devices.

0x80

STATUS, C

PROCESSING THE CARRY

BIT DURING BCD ADDITIONS

; .80 (BCD)

; test C

; inc next higher LSB

; test C

; inc next higher LSB

DS80160F-page 1

Related parts for PIC18F1320-I/SO

PIC18F1320-I/SO Summary of contents

Page 1

... PIC18F1220/1320 devices with these Device/Revision IDs: Part Number Device ID PIC18F1220 00 0111 111 PIC18F1320 00 0111 110 The Device IDs (DEVID1 and DEVID2) are located at addresses 3FFFFEh:3FFFFFh in configuration space. They are shown in hexadecimal in the format “DEVID2 DEVID1”. 1. Module: Core ...

Page 2

... Ensure that V the INTRC clock source. There may be other work arounds. Date Codes that pertain to this issue: All engineering and production devices. is greater than 4.5V, the INTRC is below 4.5V when starting DD © 2006 Microchip Technology Inc. ...

Page 3

... RB4/RX is Idle (high between bytes) before setting the ABDEN bit. Date Codes that pertain to this issue: All engineering and production devices. © 2006 Microchip Technology Inc. PIC18F1220/1320 10. Module: Data EEPROM When writing to the data EEPROM, the contents of the data EEPROM memory may not be written as expected ...

Page 4

... R/W-0 T3CKPS1 T3CKPS0 T3CCP1 ) has DEW Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ T Min Typ† Max — 5.5 — R/W-0 R/W-0 R/W-0 T3SYNC TMR3CS TMR3ON bit 0 ≤ +85°C for industrial A Units Conditions ms © 2006 Microchip Technology Inc. ...

Page 5

... Data Sheet Clarification issue 1 (CCP). Rev E Document (08/2005) Added Data Sheet Clarification issue 2 (Data EEPROM Memory). Rev F Document (03/2006) Corrected part number revision IDs in the table on page one. © 2006 Microchip Technology Inc. PIC18F1220/1320 DS80160F-page 5 ...

Page 6

Page 7

... PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and Zena are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...

Page 8

... Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 © 2006 Microchip Technology Inc. EUROPE Austria - Wels Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 ...

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