PIC16F639-I/SS Microchip Technology, PIC16F639-I/SS Datasheet - Page 6

IC MCU FLASH 2KX14 20SSOP

PIC16F639-I/SS

Manufacturer Part Number
PIC16F639-I/SS
Description
IC MCU FLASH 2KX14 20SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F639-I/SS

Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
20-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, LVD, POR, WDT
Number Of I /o
11
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT20SS1-1 - SOCKET TRANSITION 20DIP 20SSOPXLT20SS-1 - SOCKET TRANSITION 18DIP 20SSOPAC162066 - HEADER INTRFC MPLAB ICD2 20PINAC164307 - MODULE SKT FOR PM3 28SSOP
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC16F636/639
APPENDIX A:
REVISION HISTORY
Rev A Document (8/2004)
Issue 1 – When OPTION_REG bits, PS<2:0>, are
clear, multiple spurious Resets can occur when the
WDT times out.
Added Clarifications/Corrections to the Data Sheet,
Issues 1, 2 and 3 (changed to 8-pin MF saw
singulated packaging).
Rev B Document (01/2005)
Added PIC16F639 device.
Revised Module 1: Resets.
Deleted Clarification/Corrections to the Data Sheet.
Data Sheet has been updated.
Rev C Document (07/2005)
Data Sheet Clarifications/Corrections Section: Added
Module 1: New 4x4 QFN Package added.
Rev D Document (02/2006)
Data Sheet Clarifications/Corrections Section: Added
Module 2: I/O Pins.
Rev E Document (03/2006)
Data Sheet Clarifications/Corrections section: Added
Module 3: Data EEPROM Memory; Added Module 4:
Electrical Specifications. Replaced QFN Package
Drawing.
Rev F Document (06/2006)
Added Module 2: “Wake-up Reset (WUR)”, and Module
3: “Internal/External Clock Switch Over”.
Rev G Document (11/2006)
Added Module 4: “Data EEPROM Memory”.
Data Sheet Clarifications/Corrections section: removed
all sections, data sheet updated (DS41232C).
Rev H Document (06/2010)
Updated Errata to new format. Added Silicon Revisions
A1, B3 and B4.
Data Sheet Clarification: Added Module 1.
 2010 Microchip Technology Inc.
DS80204H-page 6

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