PIC16F72-I/SO Microchip Technology, PIC16F72-I/SO Datasheet - Page 64

IC PIC MCU FLASH 2KX14 28-SOIC

PIC16F72-I/SO

Manufacturer Part Number
PIC16F72-I/SO
Description
IC PIC MCU FLASH 2KX14 28-SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F72-I/SO

Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C/SPI/SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 8-bit
Package
28SOIC W
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F72-I/SO
Manufacturer:
MICROCHIP
Quantity:
3 290
Part Number:
PIC16F72-I/SO
Quantity:
5 510
Part Number:
PIC16F72-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16F72
TABLE 11-2:
DS39597B-page 62
Osc Type
Capacitor values are for design guidance only.
These capacitors were tested with the crystals listed
below for basic start-up and operation. These values
were not optimized.
Different capacitor values may be required to produce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
V
See the notes following this table for additional
information.
DD
Note 1: Higher capacitance increases the stability
XT
HS
LP
and temperature range for the application.
2: Since each resonator/crystal has its own
3: Rs may be required in HS mode, as well
4: Always verify oscillator performance over
of oscillator, but also increases the
start-up time.
characteristics, the user should consult the
resonator/crystal manufacturer for appro-
priate values of external components.
as XT mode, to avoid overdriving crystals
with low drive level specification.
the V
expected for the application.
200 kHz
200 kHz
Crystal
20 MHz
32 kHz
1 MHz
4 MHz
4 MHz
8 MHz
Freq
CAPACITOR SELECTION FOR
CRYSTAL OSCILLATOR (FOR
DESIGN GUIDANCE ONLY)
DD
and temperature range that is
Typical Capacitor Values
33 pF
15 pF
56 pF
15 pF
15 pF
15 pF
15 pF
15 pF
C1
Tested:
33 pF
15 pF
15 pF
15 pF
15 pF
15 pF
56 pF
15 pF
C2
11.2.3
For timing insensitive applications, the “RC” device
option offers additional cost savings. The RC oscillator
frequency is a function of the supply voltage, the resis-
tor (R
ing temperature. In addition to this, the oscillator
frequency will vary from unit to unit due to normal pro-
cess parameter variation. Furthermore, the difference
in lead frame capacitance between package types will
also affect the oscillation frequency, especially for low
C
variation due to tolerance of external R and C com-
ponents used. Figure 11-3 shows how the R/C
combination is connected to the PIC16F72.
FIGURE 11-3:
11.3
The PIC16F72 differentiates between various kinds of
RESET:
• Power-on Reset (POR)
• MCLR Reset during normal operation
• MCLR Reset during SLEEP
• WDT Reset (during normal operation)
• WDT Wake-up (during SLEEP)
• Brown-out Reset (BOR)
Some registers are not affected in any RESET condi-
tion. Their status is unknown on POR and unchanged
in any other RESET. Most other registers are reset to a
“RESET state” on Power-on Reset (POR), on the
MCLR and WDT Reset, on MCLR Reset during
SLEEP, and Brown-out Reset (BOR). They are not
affected by a WDT Wake-up, which is viewed as the
resumption of normal operation. The TO and PD bits
are set or cleared differently in different RESET situa-
tions, as indicated in Table 11-4. These bits are used in
software to determine the nature of the RESET. See
Table 11-6 for a full description of RESET states of all
registers.
A simplified block diagram of the on-chip RESET circuit
is shown in Figure 11-4.
Recommended values:
EXT
C
V
R
EXT
SS
EXT
EXT
values. The user also needs to take into account
V
DD
) and capacitor (C
RESET
RC OSCILLATOR
F
OSC
/4
RC OSCILLATOR MODE
OSC1
OSC2/CLKO
 2002 Microchip Technology Inc.
EXT
3 k Ω ≤ R
C
EXT
) values, and the operat-
> 20 pF
EXT
≤ 100 k Ω
PIC16F72
Internal
Clock

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