PIC16F887-I/P Microchip Technology, PIC16F887-I/P Datasheet - Page 255
![IC PIC MCU FLASH 8KX14 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16F887-I/P
Manufacturer Part Number
PIC16F887-I/P
Description
IC PIC MCU FLASH 8KX14 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.MCP1631RD-MCC2.pdf
(328 pages)
3.PIC16F882-ISS.pdf
(16 pages)
4.PIC16F882-ISS.pdf
(36 pages)
5.PIC16F883-ISO.pdf
(288 pages)
Specifications of PIC16F887-I/P
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Mfg Application Notes
Intro to Capacitive Sensing Appl Notes Layout and Physical Design Appl Note
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
35
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP/EUSART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
35
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 53273-916
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164123, DM164120-3, DV164122
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD444-1001 - DEMO BOARD FOR PICMICRO MCU
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F887-I/P
Manufacturer:
MICROCHIP
Quantity:
16
Part Number:
PIC16F887-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
PIC16F887-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
17.6
© 2009 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
3:
Thermal Considerations
θ
θ
T
PD
P
P
P
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (P
DD
A
JA
JC
J
INTERNAL
I
DER
/
O
= Ambient Temperature.
Sym.
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C ≤ T
Characteristic
A
≤ +125°C
DER
).
PIC16F882/883/884/886/887
Typ.
47.2
24.4
45.8
60.2
80.2
89.4
24.7
20.0
14.5
23.8
23.9
20.0
150
29
29
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
40-pin PDIP package
44-pin QFN package
44-pin TQFP package
28-pin PDIP package
28-pin SOIC package
28-pin SSOP package
28-pin QFN package
40-pin PDIP package
44-pin QFN package
44-pin TQFP package
28-pin PDIP package
28-pin SOIC package
28-pin SSOP package
28-pin QFN package
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
= Σ (I
= (T
INTERNAL
OL
J
= I
- T
* V
DD
A
Conditions
)/θ
OL
+ P
x V
) + Σ (I
JA
DD
I
/
O
DS41291F-page 253
OH
* (V
DD
- V
OH
))