PIC18F24J10-I/SP Microchip Technology, PIC18F24J10-I/SP Datasheet - Page 336
![IC PIC MCU FLASH 8KX16 28-DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC18F24J10-I/SP
Manufacturer Part Number
PIC18F24J10-I/SP
Description
IC PIC MCU FLASH 8KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F24J10-ISO.pdf
(368 pages)
3.PIC18F24J10-ISO.pdf
(6 pages)
4.PIC18F24J10-ISO.pdf
(6 pages)
5.PIC18F24J10-ISO.pdf
(12 pages)
6.PIC18F44J10-IPT.pdf
(358 pages)
Specifications of PIC18F24J10-I/SP
Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SPIC/I2C/EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
3
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM183032, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Package
28SPDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162074 - HEADER INTRFC MPLAB ICD2 44TQFPAC162067 - HEADER INTRFC MPLAB ICD2 40/28P
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC18F24J10-ISO PDF datasheet #2
- PIC18F24J10-ISO PDF datasheet #3
- PIC18F24J10-ISO PDF datasheet #4
- PIC18F24J10-ISO PDF datasheet #5
- PIC18F44J10-IPT PDF datasheet #6
- Current page: 336 of 358
- Download datasheet (6Mb)
PIC18F45J10 FAMILY
28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS39682C-page 334
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 2 3
b
D
Dimension Limits
e
Preliminary
Units
A2
E1
A2
A1
E1
L1
N
A
E
D
e
h
L
φ
c
b
α
β
α
E
2.05
0.10
0.25
0.40
0.18
0.31
MIN
φ
0°
5°
5°
–
L1
L
MILLMETERS
10.30 BSC
17.90 BSC
1.27 BSC
7.50 BSC
1.40 REF
h
NOM
28
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-052B
h
© 2007 Microchip Technology Inc.
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
8°
β
–
c
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