PIC16F676-I/P Microchip Technology, PIC16F676-I/P Datasheet - Page 131

IC MCU FLASH 1K W/AD 14-DIP

PIC16F676-I/P

Manufacturer Part Number
PIC16F676-I/P
Description
IC MCU FLASH 1K W/AD 14-DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F676-I/P

Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
12
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Data Rom Size
128 B
Height
3.3 mm
Length
19.05 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
6.35 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F676-I/P
Manufacturer:
RENESAS
Quantity:
5 600
Part Number:
PIC16F676-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
PIC16F676-I/P
0
Company:
Part Number:
PIC16F676-I/P
Quantity:
3 000
Company:
Part Number:
PIC16F676-I/P
Quantity:
6 000
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
* JW Devices are UV erasable and can be programmed to any device configuration. JW Devices meet the electrical requirement of
each oscillator type.
Sales and Support
 2003 Microchip Technology Inc.
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
Device
Temperature Range
Package
Pattern
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
PART NO.
Device
Temperature
I
E
P
SN
ST
3-Digit Pattern Code for QTP (blank otherwise)
: Standard V
T: (Tape and Reel)
Range
X
=
=
=
=
=
-40°C to +85°C
-40°C to +125°C
DD
PDIP
SOIC (Gull wing, 150 mil body)
TSSOP(4.4 mm)
Package
range
/XX
Pattern
XXX
Examples:
a)
b)
PIC16F630 – E/P 301 = Extended Temp., PDIP
package, 20 MHz, QTP pattern #301
PIC16F676
package, 20 MHz
PIC16F630/676
– I/SO = Industrial Temp., SOIC
DS40039C-page 129

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