PIC16F684-I/P Microchip Technology, PIC16F684-I/P Datasheet - Page 73

IC PIC MCU FLASH 2KX14 14DIP

PIC16F684-I/P

Manufacturer Part Number
PIC16F684-I/P
Description
IC PIC MCU FLASH 2KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F684-I/P

Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Eeprom Size
256 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSACICE0207 - MPLABICE 14P 300 MIL ADAPTERAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F684-I/P
Manufacturer:
ANPEC
Quantity:
12 000
Part Number:
PIC16F684-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
PIC16F684-I/P
0
4.2
1997 Microchip Technology Inc.
OSC2/CLKOUT
(RC mode)
Clocking Scheme/Instruction Cycle
OSC1
Q4
PC
Q2
Q3
Q1
The clock input (from OSC1) is internally divided by four to generate four non-overlapping
quadrature clocks, namely Q1, Q2, Q3, and Q4. Internally, the program counter (PC) is incre-
mented every Q1, and the instruction is fetched from the program memory and latched into the
instruction register in Q4. The instruction is decoded and executed during the following Q1
through Q4. The clocks and instruction execution flow are illustrated in
Example
Figure 4-3: Clock/Instruction Cycle
Q1
Execute INST (PC-1)
Fetch INST (PC)
Q2
T
4-1.
CY
PC
1
Q3
Q4
Q1
Execute INST (PC)
Fetch INST (PC+1)
Section 4. Architecture
Q2
T
PC+1
CY
2
Q3
Q4
Q1
Execute INST (PC+1)
Fetch INST (PC+2)
Q2
T
PC+2
CY
3
Q3
Q4
DS31004A-page 4-5
Figure
Internal
phase
clock
4-3, and
4

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