PIC16F684-I/P Microchip Technology, PIC16F684-I/P Datasheet - Page 678
![IC PIC MCU FLASH 2KX14 14DIP](/photos/6/59/65935/150-14-dip_sml.jpg)
PIC16F684-I/P
Manufacturer Part Number
PIC16F684-I/P
Description
IC PIC MCU FLASH 2KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F684-ISL.pdf
(4 pages)
4.PIC16F684-ISL.pdf
(192 pages)
5.PIC16F684-ISL.pdf
(6 pages)
6.PIC16F684-IST.pdf
(164 pages)
Specifications of PIC16F684-I/P
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Eeprom Size
256 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSACICE0207 - MPLABICE 14P 300 MIL ADAPTERAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F684-I/P
Manufacturer:
ANPEC
Quantity:
12 000
Part Number:
PIC16F684-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F684-ISL PDF datasheet #3
- PIC16F684-ISL PDF datasheet #4
- PIC16F684-ISL PDF datasheet #5
- PIC16F684-IST PDF datasheet #6
- Current page: 678 of 688
- Download datasheet (3Mb)
PICmicro MID-RANGE MCU FAMILY
I
DS31035A-page 35-6
I
Inter-Integrated Circuit. This is a two wire communication interface. This feature is one of the
modes of the SSP module.
Indirect Addressing
When the Data Memory Address is not contained in the Instruction. The instruction operates on
the INDF address, which causes the Data Memory Address to be the value in the FSR register.
The execution of the instruction will always access the data at the address pointed to by the FSR
register.
Instruction Bus
The bus which is used to transfer instruction words from the program memory to the CPU.
Instruction Fetch
Due to the Harvard architecture, when one instruction is to be executed, the next location in pro-
gram memory is “fetched” and ready to be decoded as soon as the currently executing instruction
is completed.
Instruction cycle
The events for an instruction to execute. There are four events which can generally be described
as: Decode, Read, Execute, and Write. Not all events will be done by all instructions. To see the
operations during the instruction cycle, please look in the description of each instruction. Four
external clocks (Tosc) make one instruction cycle (T
Interrupt
A signal to the CPU that causes the program flow to be forced to the Interrupt Vector Address
(04h in program memory). Before the program flow is changed, the contents of the Program
Counter (PC) are forced onto the hardware stack, so that program execution may return to the
interrupted point.
INTRC
Internal Resistor-Capacitor (RC). Some devices have a device oscillator option that allows the
clock to come from an internal RC.
2
C
CY
).
1997 Microchip Technology Inc.
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