ATTINY13A-SSU Atmel, ATTINY13A-SSU Datasheet - Page 163

• Manufacturer Part Number: ATTINY13A-SSU
• Description: IC MCU AVR 1K FLASH 20MHZ 8SOIC
• Manufacturer: Atmel
• Series: AVR® ATtinyr

Specifications of ATTINY13A-SSU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 6
• Program Memory Size: 1KB (512 x 16)
• Program Memory Type: FLASH
• Eeprom Size: 64 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Cpu Family: ATtiny
• Device Core: AVR
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: SPI
• Total Internal Ram Size: 64Byte
• # I/os (max): 6
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 4-chx10-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: SOIC
• Package: 8SOIC
• Family Name: ATtiny
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 6
• Number Of Timers: 1
• Processor Series: ATTINY1x
• Core: AVR8
• Data Ram Size: 64 B
• Maximum Clock Frequency: 20 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Development Tools By Supplier: ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATAKSTK511
• Minimum Operating Temperature: - 40 C
• For Use With: ATSTK600-DIP40 - STK600 SOCKET/ADAPTER 40-PDIP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRDRAGON - KIT DRAGON 32KB FLASH MEM AVRATAVRISP2 - PROGRAMMER AVR IN SYSTEMATJTAGICE2 - AVR ON-CHIP D-BUG SYSTEM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Connectivity: -
• Lead Free Status / Rohs Status: Compliant

23. Packaging Information
23.1
8126E–AVR–07/10
Notes:
8P3
R
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
2325 Orchard Parkway
San Jose, CA 95131
D1
4 PLCS
b3
Side View
Top View
D
e
N
1
b
b2
TITLE
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
A2 A
L
c
End View
SYMBOL
A
A2
b
b2
b3
c
D
D1
E
E1
e
eA
L
eA
E1
E
(Unit of Measure = inches)
COMMON DIMENSIONS
MIN
0.115
0.014
0.045
0.030
0.008
0.355
0.005
0.300
0.240
0.115
0.100 BSC
0.300 BSC
NOM
0.130
0.018
0.060
0.039
0.010
0.365
0.310
0.250
0.130
DRAWING NO.
MAX
0.210
0.195
0.022
0.070
0.045
0.014
0.400
0.325
0.280
0.150
8P3
NOTE
2
5
6
6
3
3
4
3
4
2
01/09/02
REV.
B
163