PIC12F635-I/SN Microchip Technology, PIC12F635-I/SN Datasheet - Page 221
PIC12F635-I/SN
Manufacturer Part Number
PIC12F635-I/SN
Description
IC MCU FLASH 1KX14 8SOIC
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F635-ISN.pdf
(234 pages)
2.PIC12F635-ISN.pdf
(8 pages)
3.PIC16F636-IST.pdf
(196 pages)
Specifications of PIC12F635-I/SN
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
8-SOIC (3.9mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
5
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232/SPI/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
6
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029, DV164101, DM163014
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162057 - MPLAB ICD 2 HEADER 14DIP
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12F635-I/SN
Manufacturer:
MICROCHIP
Quantity:
1 200
Part Number:
PIC12F635-I/SN
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
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© 2007 Microchip Technology Inc.
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
1 2
b
D
Dimension Limits
PIC12F635/PIC16F636/639
e
E1
A2
E
Units
c
A2
A1
E1
L1
N
A
E
D
e
L
φ
c
b
L1
0.80
0.05
4.30
4.90
0.45
0.09
0.19
MIN
0°
–
MILLIMETERS
6.40 BSC
0.65 BSC
1.00 REF
NOM
1.00
4.40
5.00
0.60
14
–
–
–
–
–
Microchip Technology Drawing C04-087B
MAX
1.20
1.05
0.15
4.50
5.10
0.75
0.20
0.30
8°
DS41232D-page 219
φ
L
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