PIC16F716-I/SO Microchip Technology, PIC16F716-I/SO Datasheet - Page 71
![IC PIC MCU FLASH 2KX14 18SOIC](/photos/6/76/67656/150-18-soic_sml.jpg)
PIC16F716-I/SO
Manufacturer Part Number
PIC16F716-I/SO
Description
IC PIC MCU FLASH 2KX14 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F716-ISO.pdf
(136 pages)
4.PIC16F716-ISO.pdf
(12 pages)
5.PIC16F716-ESO.pdf
(126 pages)
Specifications of PIC16F716-I/SO
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
18-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
13
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
13
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 8-bit
Package
18SOIC W
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILI3-DB16F716 - BOARD DAUGHTER ICEPIC3AC162054 - HEADER INTERFACE ICD2 16F716AC164010 - MODULE SKT PROMATEII DIP/SOIC
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F716-I/SO
Manufacturer:
MICROCHI
Quantity:
42
Part Number:
PIC16F716-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
9.13
Power-down mode is entered by executing a SLEEP
instruction.
If enabled, the Watchdog Timer will be cleared but
keeps running, the PD bit (STATUS<3>) is cleared, the
TO (STATUS<4>) bit is set, and the oscillator driver is
turned off. The I/O ports maintain the status they had,
before the SLEEP instruction was executed (driving
high, low or high-impedance).
For lowest current consumption in this mode, place all
I/O pins at either V
circuitry is drawing current from the I/O pin, power-
down the A/D and the disable external clocks. Pull all
I/O pins that are hi-impedance inputs, high or low
externally, to avoid switching currents caused by
floating inputs. The T0CKI input should also be at V
or
contribution from on-chip pull-ups on PORTB should be
considered.
The MCLR pin must be at a logic high level (parameter
D042).
9.13.1
The device can wake-up from Sleep through one of the
following events:
1.
2.
3.
External MCLR Reset will cause a device Reset. All
other events are considered a continuation of program
execution and cause a “wake-up”. The TO and PD bits
in the Status register can be used to determine the
cause of device Reset. The PD bit, which is set on
power-up, is cleared when Sleep is invoked. The TO bit
is cleared if a WDT time-out occurred (and caused
wake-up).
2003 Microchip Technology Inc.
V
External Reset input on MCLR pin.
Watchdog Timer Wake-up (if WDT was
enabled).
Interrupt from INT pin, RB port change or some
peripheral interrupts.
SS
Power-down Mode (Sleep)
for
WAKE-UP FROM SLEEP
lowest
DD
current
or V
SS
, ensure no external
consumption.
The
Preliminary
DD
The following peripheral interrupts can wake the device
from Sleep:
1.
2.
3.
Other peripherals cannot generate interrupts, since
during Sleep, no on-chip clocks are present.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is pre-fetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be set (enabled). Wake-up is
regardless of the state of the GIE bit. If the GIE bit is
clear (disabled), the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
set (enabled), the device executes the instruction after
the SLEEP instruction and then branches to the
interrupt address (0004h). In cases where the
execution of the instruction following SLEEP is not
desirable, the user should have a NOP after the SLEEP
instruction.
9.13.2
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
• If the interrupt occurs before the execution of a
• If the interrupt occurs during or after the
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes. To
determine whether a SLEEP instruction executed, test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
To ensure that the WDT is cleared, a CLRWDT
instruction should be executed before a SLEEP
instruction.
SLEEP instruction, the SLEEP instruction will
complete as a NOP. Therefore, the WDT and WDT
postscaler will not be cleared, the TO bit will not
be set and PD bits will not be cleared.
execution of a SLEEP instruction, the device will
immediately wake-up from Sleep. The SLEEP
instruction will be completely executed before the
wake-up. Therefore, the WDT and WDT
postscaler will be cleared, the TO bit will be set
and the PD bit will be cleared.
TMR1 interrupt. Timer1 must be operating as an
asynchronous counter.
ECCP capture mode interrupt.
ADC running in ADRC mode.
WAKE-UP USING INTERRUPTS
PIC16F716
DS41206A-page 69