PIC16F716-I/SO Microchip Technology, PIC16F716-I/SO Datasheet - Page 60
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PIC16F716-I/SO
Manufacturer Part Number
PIC16F716-I/SO
Description
IC PIC MCU FLASH 2KX14 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F716-ISO.pdf
(136 pages)
4.PIC16F716-ISO.pdf
(12 pages)
5.PIC16F716-ESO.pdf
(126 pages)
Specifications of PIC16F716-I/SO
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
18-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
13
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
13
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 8-bit
Package
18SOIC W
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILI3-DB16F716 - BOARD DAUGHTER ICEPIC3AC162054 - HEADER INTERFACE ICD2 16F716AC164010 - MODULE SKT PROMATEII DIP/SOIC
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F716-I/SO
Manufacturer:
MICROCHI
Quantity:
42
Part Number:
PIC16F716-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16F716
9.2.3
For timing insensitive applications, the “RC” device
option offers additional cost savings. The RC oscillator
frequency is a function of the supply voltage, the
resistor (R
operating temperature. In addition to this, the oscillator
frequency will vary from unit to unit due to normal
process
difference in lead frame capacitance between package
types will also affect the oscillation frequency,
especially for low C
take into account variation due to tolerance of external
R and C components used. Figure 9-3 shows how the
R/C combination is connected to the PIC16F716.
FIGURE 9-3:
9.3
The PIC16F716 differentiates between various kinds of
Reset:
• Power-on Reset (POR)
• MCLR Reset during normal operation
• MCLR Reset during Sleep
• WDT Reset (during normal operation)
• WDT Wake-up (during Sleep)
• Brown-out Reset (BOR)
Some registers are not affected in any Reset condition;
their status is unknown on POR and unchanged in any
other Reset. Most other registers are reset to a “Reset
state” on Power-on Reset (POR), on the MCLR and
WDT Reset, on MCLR Reset during Sleep and Brown-
out Reset (BOR). They are not affected by a WDT
Wake-up, which is viewed as the resumption of normal
operation. The TO and PD bits are set or cleared differ-
ently in different Reset situations as indicated in
Table 9-4. These bits are used in software to determine
the nature of the Reset. See Table 9-6 for a full
description of Reset states of all registers.
DS41206A-page 58
Recommended values:
3 k
10 k
C
C
V
R
EXT
EXT
SS
EXT
V
DD
R
20 pF
R
Reset
EXT
EXT
parameter
EXT
RC OSCILLATOR
) and capacitor (C
100 k
F
100 k
OSC
EXT
/4
V
RC OSCILLATOR MODE
V
OSC1
variation.
values. The user also needs to
DD
OSC2/CLKOUT
DD
V
V
EXT
Furthermore,
) values and the
PIC16F716
Internal
clock
Preliminary
the
A simplified block diagram of the On-chip Reset circuit
is shown in Figure 9-5.
The PICmicro
filter in the MCLR Reset path. The filter will detect and
ignore small pulses.
It should be noted that a WDT Reset does not drive the
MCLR pin low.
9.4
A Power-on Reset pulse is generated on-chip when
V
just tie the MCLR pin directly (or through a resistor) to
V
usually needed to create a Power-on Reset. A
maximum rise time for V
D004). For a slow rise time, see Figure 9-4.
When the device starts normal operation (exits the
Reset
(voltage, frequency, temperature,...) must be met to
ensure operation. If these conditions are not met, the
device must be held in Reset until the operating
conditions are met. Brown-out Reset may be used to
meet the start-up conditions.
FIGURE 9-4:
DD
DD
Note 1:
. This will eliminate external RC components
rise is detected. To take advantage of the POR,
2:
3:
condition),
Power-On Reset (POR)
External Power-on Reset circuit is required
only if V
diode D helps discharge the capacitor quickly
when V
R < 40 k is recommended to make sure that
voltage drop across R does not violate the
device’s electrical specification.
R1 = 100
flowing into MCLR from external capacitor C
in the event of MCLR/V
to Electrostatic Discharge (ESD) or Electrical
Overstress
®
microcontrollers have an MCLR noise
V
DD
R
DD
DD
C
V
device
powers down.
power-up slope is too slow. The
DD
EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW V
to 1 k
(EOS).
2003 Microchip Technology Inc.
DD
R1
will limit any current
is specified (parameter
operating
DD
PP
PIC16F716
MCLR
pin breakdown due
POWER-UP)
parameters