PIC16F506-I/SL Microchip Technology, PIC16F506-I/SL Datasheet - Page 89

IC PIC MCU FLASH 1KX14 14SOIC

PIC16F506-I/SL

Manufacturer Part Number
PIC16F506-I/SL
Description
IC PIC MCU FLASH 1KX14 14SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F506-I/SL

Program Memory Type
FLASH
Program Memory Size
1.5KB (1K x 12)
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
11
Ram Size
67 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
67 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
1
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
3-ch x 8-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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PIC16F506-I/SL
0
13.2
© 2006 Microchip Technology Inc.
DC CHARACTERISTICS
D001
D002
D003
D004
D010
D020
D022
D023
D024
D025
D026
Legend: TBD = To be determined.
Note 1:
Parm
No.
2:
3:
4:
5:
*
DC Characteristics: PIC12F510/16F506 (Extended)
V
S
CV
Sym
IV
V
V
a) The test conditions for all I
b) For standby current measurements, the conditions are the same, except that the device is in Sleep
These parameters are characterized but not tested.
Data in the Typical (“Typ”) column is based on characterization results at 25 C. This data is for design
guidance only and is not tested.
This is the limit to which V
The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
Does not include current through R
estimated by the formula:
I = V
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
I
I
I
I
I
POR
VDD
WDT
DD
PD
CMP
ADC
DD
DR
REF
REF
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
MCLR = V
WDT enabled/disabled as specified.
mode.
DD
/2R
Supply Voltage
RAM Data Retention
Voltage
V
ensure Power-on Reset
V
Power-on Reset
Supply Current
Power-Down Current
WDT Current
Comparator Current
ADC Current
Internal Reference
Current
Comparator Voltage
Reference Current
DD
DD
EXT
Start Voltage to
Rise Rate to ensure
Characteristic
DD
(mA) with R
(2)
;
(5)
(3)
DD
EXT
can be lowered in Sleep mode without losing RAM data.
DD
(5)
in k .
measurements in active operation mode are:
Standard Operating Conditions (unless otherwise specified)
Operating Temperature -40 C
0.05*
EXT
Min
2.0
Preliminary
(in EXTRC mode only). The current through the resistor can be
Typ
1.5*
Vss
385
170
100
0.4
1.7
0.1
1.0
15
15
80
58
(1)
Max Units
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
5.5
V/ms See Section 10.4 “Power-on Reset
PIC12F510/16F506
mA
mA
V
V
V
A
A
A
A
A
A
A
A
A
See Figure 13-1
Device in Sleep mode
See Section 10.4 “Power-on Reset
(POR)”
(POR)” for details
F
F
F
F
F
disabled
V
V
V
V
V
V
OSC
OSC
OSC
OSC
OSC
DD
DD
DD
DD
DD
DD
T
A
= 2.0V
= 2.0V
= 2.0V
= 2.0V
= 2.0V
= 2.0V
= 4 MHz, V
= 4 MHz, V
= 8 MHz, V
= 20 MHz, V
= 32 kHz, V
+125 C (Extended)
Conditions
DD
DD
DD
DD
DD
= 5.0V
= 2.0V
= 3.0V
= 2.0V, WDT
SS
= 5.0V
, T0CKI = V
DS41268B-page 87
(4)
DD
or V
DD
SS
,
.

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