TV04A180JB-G Comchip Technology, TV04A180JB-G Datasheet - Page 5
![TVS 400W 18V BIDIRECT SMA](/photos/39/67/396748/sma_sml.jpg)
TV04A180JB-G
Manufacturer Part Number
TV04A180JB-G
Description
TVS 400W 18V BIDIRECT SMA
Manufacturer
Comchip Technology
Specifications of TV04A180JB-G
Voltage - Reverse Standoff (typ)
18V
Voltage - Breakdown
20V
Power (watts)
400W
Polarization
Bidirectional
Mounting Type
Surface Mount
Package / Case
DO-214AC, SMA
Channels
1 Channel
Clamping Voltage
29.2 V
Operating Voltage
3.5 V
Breakdown Voltage
20 V
Peak Surge Current
40 A
Peak Pulse Power Dissipation
400 W
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 5
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 7
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 8
Table 1. Am29F160D Device Bus Operations . . . . . 8
Word/Byte Configuration . . . . . . . . . . . . . . . . . . . . . 8
Requirements for Reading Array Data . . . . . . . . . . . 8
Writing Commands/Command Sequences . . . . . . . 9
Program and Erase Operation Status . . . . . . . . . . . 9
Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Automatic Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . 9
RESET#: Hardware Reset Pin . . . . . . . . . . . . . . . . . 9
Output Disable Mode . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 2. Am29F160DT Sector Address Table (Top
Boot) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 3. Am29F160DB Sector Address Table (Bottom
Boot) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Autoselect Mode . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 4. Am29F160D Autoselect Codes (High Voltage
Method) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Sector Protection/Unprotection . . . . . . . . . . . . . . . 12
Write Protect (WP#) . . . . . . . . . . . . . . . . . . . . . . . . 13
Temporary Sector Unprotect . . . . . . . . . . . . . . . . . 13
Figure 1. Temporary Sector Unprotect Operation . 13
In-System Sector Protect/Unprotect Algorithms. . . 14
Common Flash Memory Interface (CFI) . . . . . . . 15
Table 5. CFI Query Identification String . . . . . . . . . 15
Table 6. System Interface String . . . . . . . . . . . . . . 16
Table 7. Device Geometry Definition . . . . . . . . . . . 16
Table 8. Primary Vendor-Specific Extended Query 17
Hardware Data Protection . . . . . . . . . . . . . . . . . . . 18
Reading Array Data . . . . . . . . . . . . . . . . . . . . . . . . 18
Reset Command . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Autoselect Command Sequence . . . . . . . . . . . . . . 19
Word/Byte Program Command Sequence. . . . . . . 19
Figure 3. Program Operation . . . . . . . . . . . . . . . . . 20
Chip Erase Command Sequence . . . . . . . . . . . . . 20
Sector Erase Command Sequence . . . . . . . . . . . . 20
Erase Suspend/Erase Resume Commands . . . . . 21
Figure 4. Erase Operation . . . . . . . . . . . . . . . . . . . 21
Command Definitions. . . . . . . . . . . . . . . . . . . . . . . 22
Table 9. Am29F160D Command Definitions . . . . . 22
Write Operation Status . . . . . . . . . . . . . . . . . . . . 23
April 23, 2010 Am29F160D_00_D10
D A T A S H E E T
Am29F160D
DQ7: Data# Polling . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 5. Data# Polling Algorithm . . . . . . . . . . . . . . 23
RY/BY#: Ready/Busy# . . . . . . . . . . . . . . . . . . . . . . 24
DQ6: Toggle Bit I . . . . . . . . . . . . . . . . . . . . . . . . . . 24
DQ2: Toggle Bit II . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Reading Toggle Bits DQ6/DQ2. . . . . . . . . . . . . . . . 24
DQ5: Exceeded Timing Limits . . . . . . . . . . . . . . . . 25
DQ3: Sector Erase Timer . . . . . . . . . . . . . . . . . . . . 25
Figure 6. Toggle Bit Algorithm . . . . . . . . . . . . . . . . 25
Table 10. Write Operation Status . . . . . . . . . . . . . . 26
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 27
Figure 7. Maximum Negative Overshoot Waveform 27
Figure 8. Maximum Positive Overshoot Waveform. 27
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 27
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 28
TTL/NMOS Compatible. . . . . . . . . . . . . . . . . . . . . . 28
CMOS Compatible . . . . . . . . . . . . . . . . . . . . . . . . . 29
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 9. Test Setup . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 11. Test Specifications . . . . . . . . . . . . . . . . . 30
Key to Switching Waveforms. . . . . . . . . . . . . . . . 30
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 10. Read Operations Timings . . . . . . . . . . . 31
Figure 11. RESET# Timings . . . . . . . . . . . . . . . . . . 32
Figure 12. BYTE# Timings for Read Operations . . 33
Figure 13. BYTE# Timings for Write Operations. . . 33
Figure 14. Program Operation Timings. . . . . . . . . . 35
Figure 15. Chip/Sector Erase Operation Timings . . 36
Figure 16. Data# Polling Timings (During Embedded
Algorithms) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 17. Toggle Bit Timings (During Embedded Algo-
rithms) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 18. DQ2 vs. DQ6 . . . . . . . . . . . . . . . . . . . . . 38
Figure 19. Temporary Sector Unprotect Timing Dia-
gram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Figure 20. Sector Protect/Unprotect
Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 21. Alternate CE# Controlled Write Operation
Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Erase and Programming Performance . . . . . . . . 42
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 42
TSOP and SO Pin Capacitance . . . . . . . . . . . . . . 42
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 43
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 44
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