ESD8V0L1B-02LRH E6327 Infineon Technologies, ESD8V0L1B-02LRH E6327 Datasheet - Page 5

TVS LO CAP 1CHAN BIDIR TSLP-2

ESD8V0L1B-02LRH E6327

Manufacturer Part Number
ESD8V0L1B-02LRH E6327
Description
TVS LO CAP 1CHAN BIDIR TSLP-2
Manufacturer
Infineon Technologies
Datasheet

Specifications of ESD8V0L1B-02LRH E6327

Package / Case
TSLP-2-7
Voltage - Reverse Standoff (typ)
8V
Voltage - Breakdown
14.5V
Polarization
Bidirectional
Mounting Type
Surface Mount
Polarity
Bidirectional
Channels
1 Channel
Clamping Voltage
26 V
Operating Voltage
14 V
Breakdown Voltage
14.5 V
Termination Style
SMD/SMT
Peak Surge Current
2.5 A
Capacitance
13 pF
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 55 C
Dimensions
0.6 mm W x 1 mm L
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
8V0L1B02LRHE6327XT
ESD8V0L1B-02LRHE6327INTR
SP000235246
Application example ESD8V0L2B...
2 channels, bi-directional
Application example ESD8V0L2B...
1 high-speed channel, bi-directional
Application example ESD8V0L1B-02LRH
1 channel, bi-directional
Protected high-speed signal line, level up to
2 protected signal lines, level up to
-8V/+14V or +14V (uni-directional)
Protected signal line, level up to
1
2
3
1
±22V (bi-directional)
2
1
-8/+14V or +8/-14 V
2
Pin 1 (or Pin 2) should be connected directly to a
ground plane on the board .
The protection diode should be placed very
close to the location where the ESD or
other transients can occur to keep loops
and inductances as small as possible.
Pin 3 should be connected directly to a
ground plane on the board.
5
3
Pin 1 (or pin 2) should be
connected directly to a
ground plane on the board.
Pin 3 is not connected.
I/O
I/O
I/O
I/O
ESD sensitive
ESD sensitive
ESD sensitive
device
device
device
ESD8V0L...
2009-07-07

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