PESD5V0L4UG,115 NXP Semiconductors, PESD5V0L4UG,115 Datasheet - Page 12

• Manufacturer Part Number: PESD5V0L4UG,115
• Description: DIODE LOW ESD PROTECTION SOT353
• Manufacturer: NXP Semiconductors
• Type: TVSr
• Series: -r

Specifications of PESD5V0L4UG,115

• Package / Case: SC-70-5, SC-88A, SOT-323-5, SOT-353, 5-TSSOP
• Voltage - Reverse Standoff (typ): 5V
• Voltage - Breakdown: 5.32V
• Power (watts): 30W
• Polarization: 4 Channel Array - Unidirectional
• Mounting Type: Surface Mount
• Polarity: Unidirectional
• Clamping Voltage: 10 V
• Operating Voltage: 5 V
• Breakdown Voltage: 6.8 V
• Termination Style: SMD/SMT
• Peak Surge Current: 2.5 A
• Peak Pulse Power Dissipation: 30 W
• Capacitance: 19 pF
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 65 C
• Dimensions: 1.35 mm W x 2.2 mm L x 1.1 mm H
• Number Of Elements: 4
• Operating Temperature Classification: Military
• Reverse Breakdown Voltage: 6.46V
• Reverse Stand-off Voltage: 5V
• Leakage Current (max): 25nA
• Peak Pulse Current: 2.5A
• Test Current (it): 1mA
• Operating Temp Range: -65C to 150C
• Mounting: Surface Mount
• Pin Count: 5
• Capacitance Value: 19 pF
• Maximum Clamping Voltage: 13 V
• Direction Type: Uni-Directional
• Number Of Elements Per Chip: 4
• Esd Protection Voltage: 10@HBM|20@Contact Disc KV
• Maximum Leakage Current: 0.025 uA
• Maximum Working Voltage: 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4051-2; 934057785115; PESD5V0L4UG T/R; PESD5V0L4UG T/R

NXP Semiconductors
9. Packing information
Table 10.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
[2]
[3]
[4]
10. Soldering
PESDXL4UF_G_W_4
Product data sheet
Type number
PESD3V3L4UF
PESD5V0L4UF
PESD3V3L4UG
PESD5V0L4UG
PESD3V3L4UW
PESD5V0L4UW
For further information and the availability of packing methods, see
T1: normal taping
T4: 90 rotated reverse taping
T2: reverse taping
Packing methods
Package
SOT886
SOT886
SOT353
SOT353
SOT665
SOT665
Fig 13. Reflow soldering footprint PESDxL4UF (SOT886)
Description
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T4
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T4
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
Reflow soldering is the only recommended soldering method.
Low capacitance unidirectional quadruple ESD protection diode arrays
0.370
0.270
(6 )
(6 )
Rev. 04 — 28 February 2008
0.325
(6 )
1.250
0.675
Section
0.425
(6
[1]
13.
0.500
0.500
[2]
[3]
[2]
[3]
[2]
[4]
[2]
[4]
1.700
Packing quantity
3000
-
-
-
-
-115
-125
-115
-125
-
-
-
-
PESDxL4UF/G/W
Dimensions in mm
4000
-
-
-
-
-
-
-
-
-
-115
-
-115
solder lands
solder paste
occupied area
5000
-115
-132
-115
-132
-
-
-
-
-
-
-
-
sot886_fr
© NXP B.V. 2008. All rights reserved.
8000
-
-
-
-
-
-
-
-
-315
-
-315
-
10000
-
-
-
-
-135
-165
-135
-165
-
-
-
-
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