PESD5V0X1BL,315 NXP Semiconductors, PESD5V0X1BL,315 Datasheet
PESD5V0X1BL,315
Specifications of PESD5V0X1BL,315
934061649315
PESD5V0X1BL T/R
Related parts for PESD5V0X1BL,315
PESD5V0X1BL,315 Summary of contents
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PESD5V0X1BA; PESD5V0X1BL Ultra low capacitance bidirectional ESD protection diodes Rev. 01 — 4 November 2008 1. Product profile 1.1 General description Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diodes in small Surface-Mounted Device (SMD) plastic packages designed to protect ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin PESD5V0X1BA 1 2 PESD5V0X1BL 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Type number PESD5V0X1BA PESD5V0X1BL 4. Marking Table 5. Type number PESD5V0X1BA PESD5V0X1BL 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). ...
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... NXP Semiconductors Table unless otherwise specified. amb Symbol Per diode V ESD [1] Device stressed with ten non-repetitive ESD pulses. Table 8. Standard Per diode IEC 61000-4-2; level 4 (ESD) MIL-STD-883; class 3 (human body model) Fig 1. PESD5V0X1BA_PESD5V0X1BL_1 Product data sheet PESD5V0X1BA; PESD5V0X1BL Ultra low capacitance bidirectional ESD protection diodes ...
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... NXP Semiconductors 6. Characteristics Table unless otherwise specified. amb Symbol Per diode V RWM dif 1 (pF) 0.96 0.92 0.88 0.84 0. MHz amb Fig 2. Diode capacitance as a function of reverse voltage; typical values PESD5V0X1BA_PESD5V0X1BL_1 Product data sheet PESD5V0X1BA; PESD5V0X1BL Ultra low capacitance bidirectional ESD protection diodes ...
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... NXP Semiconductors ESD TESTER IEC 61000-4-2 network C = 150 pF 330 Z Z GND unclamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) GND unclamped 8 kV ESD pulse waveform (IEC 61000-4-2 network) Fig 4. ESD clamping test setup and waveforms PESD5V0X1BA_PESD5V0X1BL_1 Product data sheet PESD5V0X1BA; PESD5V0X1BL ...
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... NXP Semiconductors 7. Application information PESD5V0X1BA and PESD5V0X1BL are designed for the protection of one bidirectional data or signal line from the damage caused by ESD. The devices may be used on lines where the signal polarities are both, positive and negative with respect to ground. Fig 5. Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD and Electrical Fast Transient (EFT) ...
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... NXP Semiconductors 9. Package outline 1.35 1.15 1 2.7 1.8 2.3 1.6 2 0.40 0.25 Dimensions in mm Fig 6. Package outline PESD5V0X1BA (SOD323/SC-76) 10. Packing information Table 10. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PESD5V0X1BA PESD5V0X1BL [1] For further information and the availability of packing methods, see ...
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... NXP Semiconductors 11. Soldering 1.65 Fig 8. 2.75 Fig 9. PESD5V0X1BA_PESD5V0X1BL_1 Product data sheet PESD5V0X1BA; PESD5V0X1BL Ultra low capacitance bidirectional ESD protection diodes 3.05 2.1 0.95 2 Reflow soldering footprint PESD5V0X1BA (SOD323/SC-76) 5 2 Wave soldering footprint PESD5V0X1BA (SOD323/SC-76) Rev. 01 — 4 November 2008 ...
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... NXP Semiconductors 0.9 Fig 10. Reflow soldering footprint PESD5V0X1BL (SOD882) PESD5V0X1BA_PESD5V0X1BL_1 Product data sheet PESD5V0X1BA; PESD5V0X1BL Ultra low capacitance bidirectional ESD protection diodes 1.3 0 Reflow soldering is the only recommended soldering method. Rev. 01 — 4 November 2008 R0. 0.6 0 Dimensions in mm © NXP B.V. 2008. All rights reserved. ...
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... NXP Semiconductors 12. Revision history Table 11. Revision history Document ID PESD5V0X1BA_PESD5V0X1BL_1 20081104 PESD5V0X1BA_PESD5V0X1BL_1 Product data sheet PESD5V0X1BA; PESD5V0X1BL Ultra low capacitance bidirectional ESD protection diodes Release date Data sheet status Product data sheet Rev. 01 — 4 November 2008 Change notice Supersedes - - © NXP B.V. 2008. All rights reserved. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application information Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information Soldering ...