PESD5V0U1UB,115 NXP Semiconductors, PESD5V0U1UB,115 Datasheet - Page 6

• Manufacturer Part Number: PESD5V0U1UB,115
• Description: DIODE ESD PROT UNI 5V SC-79
• Manufacturer: NXP Semiconductors
• Type: TVSr

Specifications of PESD5V0U1UB,115

• Package / Case: SC-79, SOD-523
• Voltage - Reverse Standoff (typ): 5V
• Voltage - Breakdown: 6.8V
• Polarization: Unidirectional
• Mounting Type: Surface Mount
• Polarity: Unidirectional
• Channels: 1 Channel
• Operating Voltage: 5 V
• Breakdown Voltage: 6.8 V
• Termination Style: SMD/SMT
• Capacitance: 1.7 pF
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 55 C
• Dimensions: 1.35 mm W x 2.7 mm L x 1.1 mm H
• Capacitance Value: 2.6 pF
• Direction Type: Uni-Directional
• Number Of Elements Per Chip: 1
• Esd Protection Voltage: 10@HBM|9@Contact Disc KV
• Maximum Leakage Current: 0.1 uA
• Maximum Working Voltage: 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4671-2; 934062186115; PESD5V0U1UB T/R

NXP Semiconductors
7. Application information
8. Test information
PESD5V0U1UA_UB_UL_1
Product data sheet
8.1 Quality information
The PESD5V0U1Ux series is designed for the protection of one unidirectional data or
signal line from the damage caused by ESD. The devices may be used on lines where the
signal polarities are either positive or negative with respect to ground.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD and Electrical Fast
Transient (EFT). The following guidelines are recommended:
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors , and is
suitable for use in automotive applications.
1. Place the device as close to the input terminal or connector as possible.
2. The path length between the device and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
Fig 5.
ground loops.
vias.
Application diagram
Rev. 01 — 30 October 2008
line to be protected
(positive signal polarity)
Ultra low capacitance unidirectional ESD protection diodes
unidirectional protection of one line
DUT
GND
PESD5V0U1UA/UB/UL
line to be protected
(negative signal polarity)
006aab251
DUT
GND
© NXP B.V. 2008. All rights reserved.
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