PESD1LIN,115 NXP Semiconductors, PESD1LIN,115 Datasheet - Page 9

• Manufacturer Part Number: PESD1LIN,115
• Description: DIODE ESD PROTECTION SOD323
• Manufacturer: NXP Semiconductors

Specifications of PESD1LIN,115

• Package / Case: SC-76, SOD-323, UMD2
• Voltage - Reverse Standoff (typ): 15V
• Voltage - Breakdown: 17.1V
• Power (watts): 160W
• Polarization: Bidirectional
• Mounting Type: Surface Mount
• Polarity: Bidirectional
• Clamping Voltage: 25 V
• Operating Voltage: 24 V
• Breakdown Voltage: 18.9 V
• Termination Style: SMD/SMT
• Peak Surge Current: 3 A
• Peak Pulse Power Dissipation: 160 W
• Capacitance: 17 pF
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Dimensions: 1.35 mm W x 2.7 mm L x 1.1 mm H
• Number Of Elements: 1
• Operating Temperature Classification: Military
• Reverse Breakdown Voltage: 25.4V
• Reverse Stand-off Voltage: 24V
• Leakage Current (max): 50nA
• Peak Pulse Current: 3A
• Test Current (it): 5mA
• Operating Temp Range: -65C to 150C
• Mounting: Surface Mount
• Pin Count: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4033-2; 934058897115; PESD1LIN T/R; PESD1LIN T/R

NXP Semiconductors
11. Revision history
Table 10.
PESD1LIN_2
Product data sheet
Document ID
PESD1LIN_2
Modifications:
PESD1LIN_1
Revision history
Release date
20081112
20041026
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The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Table
voltage
Figure
Figure
Section 10
Section 12 “Legal
6: ESD electrostatic discharge capability redefined to V
6: enhanced
7: superseded by minimized package outline drawing
“Soldering”: added
Data sheet status
Product data sheet
Product data sheet
Rev. 02 — 12 November 2008
information”: updated
Change notice
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-
LIN bus ESD protection diode
ESD
Supersedes
PESD1LIN_1
-
electrostatic discharge
PESD1LIN
© NXP B.V. 2008. All rights reserved.
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