SOIC8EV Microchip Technology, SOIC8EV Datasheet - Page 39

• Manufacturer Part Number: SOIC8EV
• Description: BOARD DEMO 8SOIC/MSOP/TSSOP/DIP
• Manufacturer: Microchip Technology

Specifications of SOIC8EV

• Mfg Application Notes: Interface Product Design Guide
• Main Purpose: Bare Evaluation Board
• Embedded: No
• Primary Attributes: 8- Pin SOIC/DIP/TSSOP/MSOP Evaluation Board
• Secondary Attributes: For PICmicro® MCUs, ADCs, DACs and other Devices
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Utilized Ic / Part: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

D.1
D.2
FIGURE D-1:
© 2005 Microchip Technology Inc.
Although these vias were intended to be connected to either the V
are actually no connects. Rev 2 of the board addresses this.
INTRODUCTION
REV 1 PCB ISSUES
This appendix documents the issues with the Rev 1 PCB. The Rev 2 PCB fixes these
issues.
There are two issues with the Rev 1 PCB. These are:
1. VDD and VSS vias near each pad are No Connects (they should have been
2. The silk-screen on the bottom layer was not processed. This was anly intended
Figure D-2 shows how to determine the PCB revision.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber - Top Layer + Silk-Screen.
connected to the appropriate power or ground plane). See Figure D-1 shows the
location of these vias that are No Connects. Figure D-3 shows alternate
connections that can be made.
for indicating the circuit of the board. This can be done with a sticky label.
Appendix D. Rev. 1 PCB Errata
EVALUATION BOARD USER’S GUIDE
8-PIN SOIC/MSOP/TSSOP/DIP
DD
or V
SS
plane (as indicated), they
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