SOIC8EV Microchip Technology, SOIC8EV Datasheet - Page 21

BOARD DEMO 8SOIC/MSOP/TSSOP/DIP

SOIC8EV

Manufacturer Part Number
SOIC8EV
Description
BOARD DEMO 8SOIC/MSOP/TSSOP/DIP
Manufacturer
Microchip Technology
Datasheets

Specifications of SOIC8EV

Mfg Application Notes
Interface Product Design Guide
Main Purpose
Bare Evaluation Board
Embedded
No
Primary Attributes
8- Pin SOIC/DIP/TSSOP/MSOP Evaluation Board
Secondary Attributes
For PICmicro® MCUs, ADCs, DACs and other Devices
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Utilized Ic / Part
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
SOIC8EV
Manufacturer:
Microchip Technology
Quantity:
135
FIGURE 2-9:
© 2005 Microchip Technology Inc.
PAD4
External
to PCB
PAD1
PAD2
PAD3
R2
R1D
R1C
V
V
DD
SS
R2 is connected to pad 2
(not installed on PCB)
2.4.8
This section shows how the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board could be
used to evaluate op amp circuits. The first circuit is for the MCP601 and is shown in
Figure 2-8. Figure 2-9 shows which components on the PCB would be installed and
how the “unconnected” passive components would be jumpered into the circuit.
The second circuit is for the MCP6021 and is shown in Figure 2-10. Figure 2-11 shows
which components on the PCB would be installed and how the “unconnected” passive
components would be jumpered into the circuit.
FIGURE 2-8:
PCB Connections for Op Amp Circuit #1 (MCP601).
Trace is cut,
resistor is installed
C1
To power plane
To ground plane
Example Op Amp Circuits
C1C
R2
Op Amp Circuit #1 (MCP601).
V
SS
R1C
1
2
4
3
U1
Installation and Operation
P1
C2
8
7
6
5
C1C
V
DD
3
2
+
7
4
C (P1)
6
DS51544A-page 17
PAD7
PAD8
PAD5
PAD6

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