MPDTY111S Murata Electronics North America, MPDTY111S Datasheet - Page 14

• Manufacturer Part Number: MPDTY111S
• Description: CONV DC/DC 6W 1.0VOUT 6A SMT
• Manufacturer: Murata Electronics North America
• Series: MPDr
• Type: Point of Load (POL) Non-Isolated with UVLOr

Specifications of MPDTY111S

• Output: 1V
• Number Of Outputs: 1
• Power (watts): 6W
• Mounting Type: Surface Mount
• Voltage - Input: 3 ~ 3.63V
• Package / Case: 12-DIP SMD Module
• 1st Output: 1 VDC @ 6A
• Size / Dimension: 1.33" L x 0.61" W x 0.24" H (33.8mm x 15.4mm x 6mm)
• Power (watts) - Rated: 6W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 93%
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -
• Other names: 490-4558

12. Notice
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’ s specifications are subject to change or our
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product
Note:
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
specifications or transact the approval sheet for product specifications before ordering.
12.1. Soldering
12.2. Cleaning
12.1.2. Solder
12.1.3. Condition of Soldering
12.2.2. After cleaning, please dry the products thoroughly. If you touch the wet products ,the
12.2.3. If you don’t clean the products with no-cleaning type flux, you must confirm the
12.1.1. Flux
12.2.1. Please clean the products to remove flux by using the dip, boil, and vapor methods in isopropyl
Profile details
Soldering temperature
Soldering time
Heating time
Preheating time
Programming rate
Descending rate
Total soldering time
Time
Do not give vibration or an airing to product while solder melts under reflow process.
Please wait for products cooled down enough.
There is the possibility that products which are mounted on back side of motherboard
may fall down from the motherboard while reflow process.
Recommend to use supplemental mechanical contact to pins where is located at four
corners, by other adhesive methods, for example, a thermal setting resin, rather than
soldering.
marking on the products may be erased or blurred.
Do not measure electrical characteristics, until the products get dried enough.
reliability of the products fully in advance.
Please solder this product with Rosin Flux, which contains of 0.2wt%. or less chlorine.
Please do not use high activity acid flux or water soluble flux because they may erode metal or glass
portion of this product and may cause defectiveness or deterioration of this product.
Please use the solder H60, H63(JIS Z3282)or the equivalent type.
Please use the solder paste of equivalent type H60, H63.
Reflow Solder
alcohol for up to 5 minutes.
Please inform us if you are to use aqueous or semi-aqueous cleaning or other methods.
Do not use ultrasonic cleaning because semiconductor device on the products may be
damaged by resonance.
Reflow Soldering Profiles
JEDEC IPC/JEDEC J-STD-020D
Table 5-2 Classification Reflow Profiles
Pb-Free Assembly Large Body
：245 ºC +0/-5
：30 seconds,240∼245 ºC
：60∼150 seconds,217 ºC or more.
：60∼120seconds,150∼200 ºC
：3 ºC /sec.Max.,217∼245 ºC
：6 ºC /sec.Max.
：8 minutes Max.,25∼245 ºC
：Max 2 times.
Isolated DC-DC Converter
Motherboard
MPD6D12*S Specification
2010.5.7
14