PC3SD21YXPLF Sharp Microelectronics, PC3SD21YXPLF Datasheet - Page 12

PHOTOCOUPLER TRIAC OUT ZC 6-SMD

PC3SD21YXPLF

Manufacturer Part Number
PC3SD21YXPLF
Description
PHOTOCOUPLER TRIAC OUT ZC 6-SMD
Manufacturer
Sharp Microelectronics
Datasheet

Specifications of PC3SD21YXPLF

Voltage - Isolation
5000Vrms
Number Of Channels
1
Voltage - Off State
600V
Output Type
AC, Triac, Zero Cross
Current - Hold (ih)
100µA
Current - Dc Forward (if)
50mA
Current - Output / Channel
100mA
Mounting Type
Surface Mount
Package / Case
6-SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Gate Trigger (igt) (max)
-
Other names
425-2705-2
PC3SD21YXPCF
PC3SD21YXPCF
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Flow Soldering :
Hand soldering
Other notices
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
(˚C)
300
200
100
0
0
Terminal : 260˚C peak
( package surface : 250˚C peak)
1
Preheat
150 to 180˚C, 120s or less
2
12
3
Reflow
220˚C or more, 60s or less
4
PC3SD21NTZ Series
(min)
Sheet No.: D2-A07601EN

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