PC3SF11YVZBF Sharp Microelectronics, PC3SF11YVZBF Datasheet - Page 10

PHOTOTRIAC COUPLER 600V 6-DIPW

PC3SF11YVZBF

Manufacturer Part Number
PC3SF11YVZBF
Description
PHOTOTRIAC COUPLER 600V 6-DIPW
Manufacturer
Sharp Microelectronics
Datasheet

Specifications of PC3SF11YVZBF

Voltage - Isolation
5000Vrms
Number Of Channels
1
Voltage - Off State
600V
Output Type
AC, Triac, Standard
Current - Gate Trigger (igt) (max)
7mA
Current - Hold (ih)
100µA
Current - Dc Forward (if)
50mA
Current - Output / Channel
100mA
Mounting Type
Through Hole
Package / Case
6-DIP (0.300", 7.62mm), 5 Leads
No. Of Channels
1
Input Current
20mA
Output Voltage
600V
Opto Case Style
DIP
No. Of Pins
6
Approval Bodies
CSA
Approval Category
UL Recognised
External Depth
7.62mm
External Length /
RoHS Compliant
Isolation Voltage
5kV
Optocoupler Output Type
Phototriac
Svhc
No SVHC (15-Dec-2010)
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
425-2685-5
PC3SF11YVZBF

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PC3SF11YVZBF
Manufacturer:
WALSIN
Quantity:
3 122
Part Number:
PC3SF11YVZBF
Manufacturer:
SHARP
Quantity:
20 000
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Flow Soldering :
Hand soldering
Other notices
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
(˚C)
300
200
100
0
0
Terminal : 260˚C peak
( package surface : 250˚C peak)
1
Preheat
150 to 180˚C, 120s or less
2
10
3
Reflow
220˚C or more, 60s or less
4
PC3SF11YVZ Series
(min)
Sheet No.: D2-A08001EN

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