PC367NTJ000F Sharp Microelectronics, PC367NTJ000F Datasheet
PC367NTJ000F
Specifications of PC367NTJ000F
PC367NTJ000F
Related parts for PC367NTJ000F
PC367NTJ000F Summary of contents
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PC367NJ0000F Series ■ Description PC367NJ0000F contains an IRED optically coupled to a phototransistor packaged in a 4-pin mini-flat. Low input current type. Input-output isolation voltage(rms) is 3.75kV. Collector-emitter voltage is 80V and CTR is 100% to 500% at ...
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Internal Connection Diagram 1 2 ■ Outline Dimensions ±0.3 3.6 ±0.25 2. Date code SHARP mark "s" Anode mark ±0 0.4 Epoxy resin Product mass : approx. 0.1g Plating material : SnCu ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...
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Model Line-up Taping Package 3 000pcs/reel PC367NJ0000F PC367NT0000F Model No. PC367N1J000F PC367N1T000F PC367N2J000F PC367N2T000F Please contact a local SHARP sales representative to inquire about production status. Rank mark (I =0.5mA, V 750pcs/reel F with or without ...
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Fig.1 Test Circuit for Common Mode Rejection Voltae Fig.2 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.4 Collector Power Dissipation vs. Ambient Temperature 250 200 ...
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Fig.6 Peak Forward Current vs. Duty Ratio Pulse width≤100µ 000 100 10 −3 − Duty ratio Fig.8 Current Transfer Ratio vs. Forward Current 700 600 500 400 300 200 100 0 0.1 1 Forward current ...
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Fig.12 Collector Dark Current vs. Ambient Temperature − =50V CE −6 10 −7 10 −8 10 −9 10 −10 10 −11 10 −30 −20 − Ambient temperature T Fig.14 Response Time vs. ...
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Design Considerations ● Design guide While operating at I <0.5mA, CTR variation may increase. F Please make design considering this fact. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, ...
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Package specification ● Tape and Reel package 1. 3 000pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 ...
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Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A B ±0.3 ±0.1 12.0 5 ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...