HCPL-0466#500 Avago Technologies US Inc., HCPL-0466#500 Datasheet - Page 8

• Manufacturer Part Number: HCPL-0466#500
• Description: OPTOCOUPLER IPM/DRVR 8-SOIC
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-0466#500

• Output Type: Open Collector
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 15mA
• Data Rate: 1MBd
• Propagation Delay High - Low @ If: 200ns @ 10mA
• Current - Dc Forward (if): 25mA
• Input Type: DC
• Mounting Type: Surface Mount
• Configuration: 1 Channel
• Isolation Voltage: 3750 Vrms
• Current Transfer Ratio: 90 %
• Maximum Propagation Delay Time: 650 ns
• Maximum Forward Diode Voltage: 1.8 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Forward Diode Current: 20 mA
• Maximum Continuous Output Current: 15 mA
• Maximum Power Dissipation: 145 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Solder Reflow Temperature Profile
Recommended Pb-Free IR Profile
8
TEMPERATURE
ROOM
T
T
smax
300
200
100
smin
25
T
T
0
p
L
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE IS 245 °C
smax
217 °C
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
150 - 200 °C
= 200 °C, T
t 25 °C to PEAK
60 to 180 SEC.
smin
PREHEAT
3 °C/SEC. MAX.
= 150 °C
t
s
50
RAMP-UP
* 260 +0/-5 °C
3 °C + 1 °C/–0.5 °C
150 °C, 90 + 30 SEC.
TIME
PREHEATING TIME
t
2.5 C ± 0.5 °C/SEC.
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
245 °C
TEMP.
PEAK
150
SEC.
30
SEC.
30
50 SEC.
SOLDERING
200 °C
TIME
200
PEAK
TEMP.
240 °C
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250