MAX1831EEE Maxim Integrated Products, MAX1831EEE Datasheet - Page 12

IC REG STEP-DWN 3A W/SW 16-QSOP

MAX1831EEE

Manufacturer Part Number
MAX1831EEE
Description
IC REG STEP-DWN 3A W/SW 16-QSOP
Manufacturer
Maxim Integrated Products
Type
Step-Down (Buck)r
Datasheet

Specifications of MAX1831EEE

Internal Switch(s)
Yes
Synchronous Rectifier
Yes
Number Of Outputs
1
Voltage - Output
1.5V, 2.5V, 3.3V, Adj
Current - Output
3A
Frequency - Switching
1MHz
Voltage - Input
3 ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-QSOP
Power - Output
1.12W
Output Voltage
1.5 V to 3.3 V
Output Current
3.4 A
Input Voltage
3 V to 5.5 V
Switching Frequency
1 MHz
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MAX1831EEE
Manufacturer:
MAXIM
Quantity:
60
Part Number:
MAX1831EEE
Manufacturer:
MAXIM/美信
Quantity:
20 000
Company:
Part Number:
MAX1831EEE+
Quantity:
20
The following points are in order of decreasing impor-
tance:
1) Minimize switched-current and high-current ground
2) Connect the input filter capacitor less than 5mm
3A, 1MHz, Low-Voltage, Step-Down Regulators with
Synchronous Rectification and Internal Switches
12
loops. Connect the input capacitor’s ground, the out-
put capacitor’s ground, and PGND. Connect the
resulting island to GND at only one point.
away from IN. The connecting copper trace carries
large currents and must be at least 1mm wide,
preferably 2.5mm.
______________________________________________________________________________________
TOP VIEW
COMP
SHDN
TOFF
LX
LX
FB
IN
IN
1
2
6
3
4
5
7
8
MAX1830
MAX1831
QSOP
Pin Configuration
16
15
14
13
12
11
10
9
LX
PGND
LX
PGND
V
FBSEL
REF
GND
CC
3) Place the LX node components as close together
4) A ground plane is essential for optimum perfor-
TRANSISTOR COUNT: 3662
___________________Chip Information
and as near to the device as possible. This reduces
resistive and switching losses as well as noise.
mance. In most applications, the circuit is located on
a multilayer board, and full use of the four or more
layers is recommended. Use the top and bottom lay-
ers for interconnections and the inner layers for an
uninterrupted ground plane. Avoid large AC currents
through the ground plane.

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