NCP362CMUTBG ON Semiconductor, NCP362CMUTBG Datasheet - Page 13

• Manufacturer Part Number: NCP362CMUTBG
• Description: IC OCP TVS ESD USB POS 10-UDFN
• Manufacturer: ON Semiconductor

Specifications of NCP362CMUTBG

• Applications: Overvoltage Protection Controller
• Voltage - Supply: 1.2 V ~ 20 V
• Current - Supply: 20µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-UFQFN Exposed Pad
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Input: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PCB Recommendations
the PCB rules must be respected to properly evacuate the
heat out of the silicon. The UDFN PAD1 must be connected
to ground plane to increase the heat transfer if necessary
from an application standpoint. Of course, in any case, this
pad shall be not connected to any other potential.
decreased, allowing higher charge current to fill the battery.
between package and silicon) can handle up to 1 A (higher
than thermal capability), the following calculation shows
The NCP362 integrates a 500 mA rated PMOS FET, and
By increasing PCB area, the R
Taking into account that internal bondings (wires
Top View
qJA
310
290
270
250
230
210
190
175
150
0 25 50 75 100 125 150 175
of the package can be
Figure 30. Demo Board Layout
COPPER HEAT SPREADING AREA (mm
1 oz C.F.
http://onsemi.com
2 oz C.F.
Figure 29.
13
two different example of current capability, depending on
PCB area:
•
•
measurement on final application board to make sure of the
final Thermal Resistance.
200 225 250 275 300 325350
I = √(T
I = 800 mA
In every case, we recommend to make thermal
With 280°C/W (without PCB area), allowing DC
current is 500 mA
With 210°C/W (200 mm
allows with a 85°C ambient temperature is:
1 oz Sim
J
-T
A
)/(R
2 oz Sim
2
)
qJA
Bottom View
x R
DSON
2
), the charge DC current
)