MAX17000ETG+ Maxim Integrated Products, MAX17000ETG+ Datasheet - Page 31

• Manufacturer Part Number: MAX17000ETG+
• Description: IC PWM CTLR DDR/DDR2/DDR3 24TQFN
• Manufacturer: Maxim Integrated Products
• Series: Quick-PWM™r
• Type: DDR2/DDR3 Memory Power-Management Solutionr

Specifications of MAX17000ETG+

• Applications: Memory, DDR2/DDR3 Regulator
• Current - Supply: 2mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-TQFN Exposed Pad
• Output Voltage Range: 1 V to 2.7 V
• Input Voltage Range: 3 V to 26 V
• Input Current: 2 mA
• Power Dissipation: 2222 mW
• Operating Temperature Range: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 9. PCB Layout Example
PROCESS: BiCMOS
______________________________________________________________________________________
CSH
CSL
KELVIN-SENSE VIAS TO
INDUCTOR DCR SENSING
INDUCTOR PAD
C
EQ
EXPOSED PAD TO
ANALOG GROUND
Chip Information
CONNECT THE
VTTI BYPASS
CAPACITOR
Complete DDR2 and DDR3 Memory
UNDER THE INDUCTOR
(SEE EVALUATION KIT)
KELVIN SENSE VIAS
R
R2
R1
NTC
VTT BYPASS
CAPACITOR
Power-Management Solution
IC MOUNTED
SIDE OF PCB.
X-RAY VIEW.
ON BOTTOM
CONNECT AGND AND PGND1 TO
POWER STAGE LAYOUT (TOP SIDE OF PCB)
THE CONTROLLER AT THE
INDUCTOR
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
L1
EXPOSED PAD
24 TQFN-EP
PACKAGE
IC LAYOUT
TYPE
V
CAPACITOR
V
CAPACITOR
CC
INPUT
SMPS
DD
VIA TO POWER GROUND
BYPASS
BYPASS
OUTPUT
PACKAGE
T2444+4
CODE
Package Information
GROUND
POWER
OUTLINE
21-0139
NO.
PATTERN NO.
90-0022
LAND
31