ADP3624ARDZ Analog Devices Inc, ADP3624ARDZ Datasheet - Page 2

• Manufacturer Part Number: ADP3624ARDZ
• Description: IC DRIVER DUAL 4A NONINV 8SOIC
• Manufacturer: Analog Devices Inc

Specifications of ADP3624ARDZ

• Configuration: Low-Side
• Input Type: Non-Inverting
• Delay Time: 14ns
• Current - Peak: 4A
• Number Of Configurations: 2
• Number Of Outputs: 2
• Voltage - Supply: 4.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width) Exposed Pad, 8-eSOIC. 8-HSOIC
• Device Type: MOSFET
• Module Configuration: Low Side
• Peak Output Current: 4A
• Output Resistance: 80kohm
• Input Delay: 14ns
• Output Delay: 22ns
• Supply Voltage Range: 4.5V To 18V
• Driver Case Style: SOIC
• No.: RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADP3623/ADP3624/ADP3625/ADP3633/ADP3634/ADP3635
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 9
Test Circuit ...................................................................................... 11
REVISION HISTORY
7/09—Rev. 0 to Rev. A
Added ADP3623, ADP3625, ADP3633, and
ADP3635 .............................................................................. Universal
Changes to Features Section, General Description Section,
and Figure 1 ....................................................................................... 1
Changes to Table 1 ............................................................................ 3
Added Figure 4; Renumbered Sequentially .................................. 4
Added Figure 7 .................................................................................. 7
Added Table 3; Renumbered Sequentially .................................... 7
Added Figure 9 and Table 5 ............................................................. 8
Changes to Figure 10 ........................................................................ 9
Timing
ESD Caution .................................................................................. 6
.......................................................
.... ..... 4
Rev. A | Page 2 of 16
Theory of Operation ...................................................................... 12
Outline Dimensions ....................................................................... 15
Changes to Figure 16 to Figure 19 Captions ............................... 10
Changes to Figure 20 ...................................................................... 11
Changes to Figure 21, Input Drive Requirements (INA,
INA , INB,
Changes to Figure 23 and Parallel Operation Section ............... 13
Changes to Design Example Section ........................................... 14
Changes to Ordering Guide .......................................................... 16
5/09—Revision 0: Initial Version
Input Drive Requirements (INA, INA , INB, INB , and SD) .. 12
Low-Side Drivers (OUTA, OUTB) .......................................... 12
Shutdown (SD) Function .......................................................... 12
Overtemperature Protections ................................................... 12
Supply Capacitor Selection ....................................................... 13
PCB Layout Considerations ...................................................... 13
Parallel Operation ...................................................................... 13
Thermal Considerations ............................................................ 14
Ordering Guide .......................................................................... 16
INB , and SD) Section, and Figure 22 ........................ 12