BTS5682E Infineon Technologies, BTS5682E Datasheet - Page 10

• Manufacturer Part Number: BTS5682E
• Description: IC LED DRIVER DSO-36
• Manufacturer: Infineon Technologies

Specifications of BTS5682E

• Topology: PWM, Switched Capacitor (Charge Pump)
• Number Of Outputs: 6
• Internal Driver: Yes
• Type - Primary: Automotive
• Frequency: 2MHz
• Voltage - Supply: 3.8 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: DSO-36
• Internal Switch(s): Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Output: -
• Operating Temperature: -
• Current - Output / Channel: -
• Efficiency: -
• Lead Free Status / Rohs Status: Details
• Other names: SP000296428

Absolute Maximum Ratings (cont’d)
T
(unless otherwise specified)
Pos.
4.1.21 Current through limp home input pin
Temperatures
4.1.22 Junction temperature
4.1.23 Dynamic temperature increase while switching
4.1.24 Storage temperature
ESD Susceptibility
4.1.25 ESD resistivity
1) Not subject to production test, specified by design.
2) Device mounted on a FR4 2s2p board according to Jedec JESD51-2,-5,-7 at natural convection; The product
3) In accordance to AEC Q100-012 and AEC Q101-006.
4) R
5) Current limitation is a protection feature. Operation in current limitation is considered as “outside” normal operating range.
6) ESD resistivity, HBM according to EIA/JESD 22-A 114B (1.5k
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
4.2
Pos.
4.2.1
4.2.2
1) Not subject to production test, specified by design.
2) Device mounted on a FR4 2s2p board according to Jedec JESD51-2,-5,-7 at natural convection; The product
Data Sheet
j
= -40 °C to +150 °C; all voltages with respect to ground
(chip+package) was simulated on a 76.4 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70
Where applicable, a thermal via array under the package contacted the first inner copper layer.
Protection features are not designed for continuous repetitive operation.
(chip+package) was simulated on a 76.4 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70
Where applicable, a thermal via array under the package contacted the first inner copper layer.
I
is the internal resistance of the load dump pulse generator.
maximum rating conditions for extended periods may affect device reliability.
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
Parameter
Parameter
Junction to Case
Junction to Ambient
Thermal Resistance
1)
other pins incl. OUT vs. GND
1)
1)
OUT pins vs. VBB
Symbol
R
R
thJC
thJA
10
Min.
–
–
Symbol
I
T
∆
T
V
LHI
Ω
j
T
stg
ESD
j
, 100pF).
Limit Values
Typ.
–
22
min.
-0.75
-2.0
-40
–
-55
-4
-2
Limit Values
Max.
2
–
max.
0.75
2.0
150
60
150
4
2
Unit
K/W
K/W
Electrical Characteristics
Unit Conditions
mA –
°C
K
°C
kV
SPOC - BTS5682E
Rev. 1.0, 2008-01-22
µ
µ
Conditions
–
2)
m Cu, 2 x 35
m Cu, 2 x 35
t
–
–
–
HBM
–
–
≤ 2 min.
6)
µ
µ
m Cu).
m Cu).