PUMB9,125 NXP Semiconductors, PUMB9,125 Datasheet
PUMB9,125
Specifications of PUMB9,125
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PUMB9,125 Summary of contents
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... PEMB9; PUMB9 PNP/PNP resistor-equipped transistors k k Rev. 3 — 22 November 2011 1. Product profile 1.1 General description PNP/PNP double Resistor-Equipped Transistors (RET) in Surface-Mounted Device (SMD) plastic packages. Table 1. Type number Package PEMB9 PUMB9 1.2 Features and benefits 100 mA output current capability ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin Ordering information Table 4. Type number Package PEMB9 PUMB9 4. Marking Table 5. Type number PEMB9 PUMB9 [ placeholder for manufacturing site code PEMB9_PUMB9 Product data sheet PNP/PNP resistor-equipped transistors k k Pinning Description ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V CBO V CEO V EBO tot Per device P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...
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... NXP Semiconductors Fig 1. 6. Thermal characteristics Table 7. Symbol Per transistor R th(j-a) Per device R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. PEMB9_PUMB9 Product data sheet PNP/PNP resistor-equipped transistors k k ...
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... NXP Semiconductors 3 10 duty cycle = 1 Z th(j-a) 0.75 (K/W) 0.5 0.33 2 0.2 10 0.1 0.05 0.02 0. FR4 PCB, standard footprint Fig 2. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration for PEMB9 (SOT666); typical values 3 10 duty cycle = 1 Z th(j-a) 0.75 (K/W) 0.5 0.33 0 0.1 0.05 0.02 0. FR4 PCB, standard footprint Fig 3 ...
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... NXP Semiconductors 7. Characteristics Table amb Symbol Per transistor I CBO I CEO I EBO CEsat V I(off) V I(on) R1 R2/ [1] Characteristics of built-in transistor PEMB9_PUMB9 Product data sheet PNP/PNP resistor-equipped transistors k k Characteristics C unless otherwise specified. Parameter Conditions = collector-base cut-off ...
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... NXP Semiconductors - 100 C (1) T amb = 25 C (2) T amb = 40 C (3) T amb Fig 4. DC current gain as a function of collector current; typical values -10 V I(on) ( - 0 40 C (1) T amb = 25 C ...
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... NXP Semiconductors (pF -10 - MHz; T amb Fig 8. Collector capacitance as a function of collector-base voltage; typical values 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications ...
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... NXP Semiconductors 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PEMB9 PUMB9 [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping 11. Soldering 2 1.7 Fig 12. Reflow soldering footprint PEMB9 (SOT666) ...
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... NXP Semiconductors Fig 13. Reflow soldering footprint PUMB9 (SOT363) 4.5 Fig 14. Wave soldering footprint PUMB9 (SOT363) PEMB9_PUMB9 Product data sheet PNP/PNP resistor-equipped transistors k k 2.65 1.5 2.35 0.6 0.5 (4×) (4×) 0.5 (4×) 0.6 (4×) 1.8 1.3 1.3 2.45 5.3 All information provided in this document is subject to legal disclaimers. Rev. 3 — 22 November 2011 PEMB9 ...
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... Revision history Document ID Release date PEMB9_PUMB9 v.3 20111122 • Modifications: The format of this document has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section 1 “Product • Section 4 • ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 8 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information . . . . . . . . . . . . . . . . . . . . . 9 11 Soldering ...