BUK765R2-40B /T3 NXP Semiconductors, BUK765R2-40B /T3 Datasheet - Page 5

• Manufacturer Part Number: BUK765R2-40B /T3
• Description: MOSFET HIGH PERF TRENCHMOS
• Manufacturer: NXP Semiconductors

Specifications of BUK765R2-40B /T3

• Product Category: MOSFET
• Rohs: yes
• Transistor Polarity: N-Channel
• Drain-source Breakdown Voltage: 40 V
• Gate-source Breakdown Voltage: +/- 20 V
• Continuous Drain Current: 143 A
• Resistance Drain-source Rds (on): 0.0052 Ohms
• Configuration: Single
• Maximum Operating Temperature: + 175 C
• Mounting Style: SMD/SMT
• Package / Case: SOT-404
• Fall Time: 56 ns
• Minimum Operating Temperature: - 55 C
• Power Dissipation: 203 W
• Rise Time: 51 ns
• Factory Pack Quantity: 800
• Typical Turn-off Delay Time: 81 ns
• Part # Aliases: BUK765R2-40B,118

NXP Semiconductors
5. Thermal characteristics
Table 5.
BUK765R2-40B
Product data sheet
Symbol
R
R
Fig 4.
th(j-mb)
th(j-a)
Z
(K/W)
th(j-mb)
10
10
10
−1
−2
−3
1
10
Transient thermal impedance from junction to mounting base as a function of pulse duration
0.1
0.05
−6
0.2
0.02
Thermal characteristics
δ = 0.5
single shot
Parameter
thermal resistance from junction to
mounting base
thermal resistance from junction to
ambient
10
−5
All information provided in this document is subject to legal disclaimers.
10
−4
Rev. 3 — 22 November 2011
Conditions
see
minimum footprint ; mounted on a
printed-circuit board
Figure 4
10
−3
N-channel TrenchMOS standard level FET
10
−2
BUK765R2-40B
Min
-
-
10
P
−1
Typ
-
50
t
p
T
t
© NXP B.V. 2011. All rights reserved.
p
(s)
δ =
Max
0.74
-
03nj25
T
t
p
t
1
Unit
K/W
K/W
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