BR24L64F-WE2 Rohm Semiconductor, BR24L64F-WE2 Datasheet - Page 31

• Manufacturer Part Number: BR24L64F-WE2
• Description: IC EEPROM 64KBIT 400KHZ 8SOP
• Manufacturer: Rohm Semiconductor

Specifications of BR24L64F-WE2

• Memory Size: 64K (8K x 8)
• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Speed: 400kHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOP
• Clock Frequency: 400kHz
• Supply Voltage Range: 1.8V To 5.5V
• Memory Case Style: SOP
• No. Of Pins: 8
• Operating Temperature Range: -40°C To +85°C
• Svhc: No SVHC (18-Jun-2010)
• Package /: RoHS Compliant
• Organization: 8 Kbit x 8
• Interface Type: I2C
• Maximum Clock Frequency: 0.1 MHz
• Access Time: 3500 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Maximum Operating Current: 3 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 1.8 V, 5.5 V
• Memory Configuration: 8K X 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: BR24L64F-WE2; BR24L64F-WE2TR

● Notes on power ON
● Low voltage malfunction prevention function
● Vcc noise countermeasures
● Cautions on use
At power on, in IC internal circuit and set, Vcc rises through unstable low voltage area, and IC inside is not completely reset,
and malfunction may occur. To prevent this, functions of POR circuit and LVCC circuit are equipped. To assure the action,
observe the following condition at power on.
1. Set SDA = 'H' and SCL ='L' or 'H'
2. Start power source so as to satisfy the recommended conditions of tR, tOFF, and Vbot for operating POR circuit.
3. Set SDA and SCL so as not to become 'Hi-Z'.
When the above conditions 1 and 2 cannot be observed, take the following countermeasures.
○ Bypass capacitor
When noise or surge gets in the power source line, malfunction may occur, therefore, for removing these, it is recommended
to attach a by pass capacitor (0.1µF) between IC Vcc and GND. At that moment, attach it as close to IC as possible.
And, it is also recommended to attach a bypass capacitor between board Vcc and GND.
LVCC circuit prevents data rewrite action at low power, and prevents wrong write.
At LVCC voltage (Typ. =1.2V) or below, it prevent data rewrite.
(1)Described numeric values and data are design representative values, and the values are not guaranteed.
(2)We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further
(3)Absolute maximum ratings
(4)GND electric potential
(5)Terminal design
(6)Terminal to terminal shortcircuit and wrong packaging
(7)Use in a strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently.
sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin in
consideration of static characteristics and transition characteristics and fluctuations of external parts and our LSI.
If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded, LSI
may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of fear
exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that
conditions exceeding the absolute maximum ratings should not be impressed to LSI.
Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is lower than that of
GND terminal.
In consideration of permissible loss in actual use condition, carry out heat design with sufficient margin.
When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may
destruct LSI. And in the case of shortcircuit between LSI terminals and terminals and power source, terminal and GND
owing to foreign matter, LSI may be destructed.
a) In the case when the above conditions 1 cannot be observed. When SDA becomes 'L' at power on .
b) In the case when the above condition 2 cannot be observed.
c) In the case when the above conditions 1 and 2 cannot be observed.
SCL
SDA
V
CC
→ Control SCL and SDA as shown below, to make SCL and SDA, 'H' and 'H'.
→ After power source becomes stable, execute software reset(P26).
→ Carry out a), and then carry out b).
V
After Vcc becomes stable
Fig.57 When SCL='H' and SDA='L'
CC
0
tDH
tOFF
tLOW
tSU:DAT
tR
Vbot
Fig.56 Rise waveform diagram
31/32
After Vcc becomes stable
100ms or below 10ms or longer 0.2V or below
Recommended conditions of tR,tOFF,Vbot
10ms or below 10ms or longer 0.3V or below
Fig.58 When SCL='H' and SDA='L'
tR
tOFF
tSU:DAT
Vbot