NCP45521IMNTWG-H ON Semiconductor, NCP45521IMNTWG-H Datasheet - Page 10

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NCP45521IMNTWG-H

Manufacturer Part Number
NCP45521IMNTWG-H
Description
Power Switch ICs - Power Distribution
Manufacturer
ON Semiconductor
Datasheet

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Part Number:
NCP45521IMNTWG-H
Manufacturer:
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Quantity:
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Part Number:
NCP45521IMNTWG-H
0
PUBLICATION ORDERING INFORMATION
ecoSWITCH is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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Email: orderlit@onsemi.com
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copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
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2X
REFERENCE
NOTE 4
2X
PIN ONE
DETAIL A
0.08
0.10
0.10
0.10
K
C
C
C
Ç Ç
Ç Ç
C
e/2
BOTTOM VIEW
e
SIDE VIEW
TOP VIEW
1
8
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
D2
D
DETAIL B
A1
4
5
8X
A
8X
b
E2
E
B
0.10 C
0.05 C
A
L
A3
C
SEATING
PLANE
A B B
NOTE 3
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5817−1050
L1
http://onsemi.com
DFN8 2x2, 0.5P
EXPOSED Cu
CASE 506CC
CONSTRUCTIONS
ISSUE O
DETAIL A
ALTERNATE
A1
10
CONSTRUCTION
Ç Ç É É
É É
L
DETAIL B
ALTERNATE
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MOLD CMPD
0.20
PACKAGE
OUTLINE
A3
L
1.00
SOLDERING FOOTPRINT*
0.50
PITCH
RECOMMENDED
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
PAD AS WELL AS THE TERMINALS.
DIM
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
A1
A3
D2
E2
L1
A
b
D
E
K
L
1.70
e
DIMENSIONS: MILLIMETERS
MILLIMETERS
MIN
0.80
0.00
0.20
1.50
0.80
0.18
−−−
2.00 BSC
2.00 BSC
0.50 BSC
0.20 REF
0.27 REF
MAX
1.00
0.05
0.30
1.70
1.00
0.38
0.15
0.30
8X
8X
0.50
2.30
NCP45520/D

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