MAX9260GCB/V+TGG4 Maxim Integrated, MAX9260GCB/V+TGG4 Datasheet - Page 2

• Manufacturer Part Number: MAX9260GCB/V+TGG4
• Description: Serializers & Deserializers - Serdes Multimedia Serial Link
• Manufacturer: Maxim Integrated
• Type: Deserializerr

Specifications of MAX9260GCB/V+TGG4

• Rohs: yes
• Data Rate: 2.5 Gbit/s
• Input Type: CML
• Output Type: CMOS/LVCMOS
• Number Of Inputs: 1
• Number Of Outputs: 30
• Operating Supply Voltage: 1.7 V to 3.6 V
• Operating Temperature Range: - 40 C to + 105 C
• Package / Case: TQFP-64 EP
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT

ABSOLUTEMAXIMUMRATINGS
SUP, SUPSW, LX, EN to GND ...............................-0.3V to +42V
SUP to SUPSW .....................................................-0.3V to +0.3V
BST to GND ...........................................................-0.3V to +47V
BST to LX ...............................................................-0.3V to +6V
OUT to GND ..........................................................-0.3V to +12V
FOSC, COMP, BIAS, FSYNC, I.C., PGOOD,
LX Continuous RMS Current ...................................................4A
Output Short-Circuit Duration ....................................Continuous
*As per the JEDEC 51 standard (multilayer board).
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGETHERMALCHARACTERISTICS (Note1)
TSSOP
Note1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
ELECTRICALCHARACTERISTICS
(V
are at T
*The parametric values (min, typ, max limits) shown in the Electrical Characteristics table supersede values quoted elsewhere in this data sheet.
Supply Voltage Range
Load-Dump Event Supply
Voltage
Supply Current
Shutdown Supply Current
BIAS Regulator Voltage
BIAS Undervoltage Lockout
BIAS Undervoltage-Lockout
Hysteresis
Thermal-Shutdown Threshold
Thermal-Shutdown Threshold
Hysteresis
FB to GND ............................................................-0.3V to +6V
SUP
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
= V
A
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
= +25NC.)
SUPSW
PARAMETER
= 14V, V
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EN
= 14V, C
I
SUP_STANDBY
SYMBOL
BIAS
V
V
V
SUP_LD
I
V
V
UVBIAS
SUPSW
SHDN
I
SUP
SUP
BIAS
JC
= 1FF, R
36V, 2.2MHz Step-Down Converter
) .................3NC/W
,
JA
) .......38.3NC/W
FOSC
t
I
Standby mode, no load, V
Standby mode, no load, V
= +25°C
V
V
V
LD
LOAD
EN
SUP
BIAS
< 1s
= 0V
= 12kI, T
= V
rising
= 1.5A
with Low Operating Current
SUPSW
CONDITIONS
A
= 6V to 36V
Continuous Power Dissipation (T
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ..................................... +260
TQFN
= T
TSSOP (derate 26.1mW/
TQFN (derate 28.6mW/
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance(B
J
= -40NC to +125NC, unless otherwise noted. Typical values
OUT
OUT
= 5V
= 5V, T
A
o
C above +70NC) ............ 2285.7mW*
o
C above +70NC) .......... 2088.8mW*
MIN
3.5
4.7
2.9
A
= +70NC)
MAX16907
+175
TYP
400
3.5
3.1
15
30
30
5
5
JC
) ...............2.7NC/W
JA
MAX
5.3
3.3
36
42
60
45
12
) ..........35NC/W
UNITS
mA
mV
FA
FA
NC
NC
V
V
V
V
o
C