NLSV1T34AMX1TCG ON Semiconductor, NLSV1T34AMX1TCG Datasheet - Page 9

• Manufacturer Part Number: NLSV1T34AMX1TCG
• Description: IC XLATOR 1BIT NON-INV 6ULLGA
• Manufacturer: ON Semiconductor

Specifications of NLSV1T34AMX1TCG

• Logic Function: Translator
• Number Of Bits: 1
• Input Type: Voltage
• Output Type: Voltage
• Number Of Channels: 1
• Number Of Outputs/channel: 1
• Differential - Input:output: No/No
• Propagation Delay (max): 1.6ns
• Voltage - Supply: 0.9 V ~ 4.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 6-ULLGA
• Supply Voltage: *
• Low Level Output Current: 24mA
• Abs. Propagation Delay Time: 3.3ns
• Mounting: Surface Mount
• Pin Count: 6
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Logic Type: Dual Supply Translators
• Supply Voltage (max): 4.5 V
• Supply Voltage (min): 0.9 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: Screw
• Number Of Circuits: 2
• High Level Output Current: -24mA
• Operating Supply Voltage (typ): 1.8/2.5/3.3V
• Operating Supply Voltage (max): 4.5V
• Operating Supply Voltage (min): 0.9V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Rate: -
• Lead Free Status / Rohs Status: Compliant

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6X
REFERENCE
PIN ONE
0.05 C
0.05 C
0.10 C
0.10 C
L1
É É É É
É É É É
É É É É
BOTTOM VIEW
1
6
SIDE VIEW
TOP VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D
4
A1
3
e
6X
E
A
B
A
0.10
0.05
5X
b
C
L
C
C
NOTE 4
SEATING
PLANE
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
A
NOTE 3
ULLGA6 1.45x1.0, 0.5P
B
http://onsemi.com
CASE 613AF−01
ISSUE A
9
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.53
SOLDERMASK DEFINED*
NOTES:
MOUNTING FOOTPRINT
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
4. A MAXIMUM OF 0.05 PULL BACK OF THE
OUTLINE
ASME Y14.5M, 1994.
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
DIM
0.49
A1
L1
PKG
A
D
b
E
e
L
5X
1
MILLIMETERS
MIN
0.00
0.15
0.25
0.30
−−−
1.45 BSC
1.00 BSC
0.50 BSC
DIMENSIONS: MILLIMETERS
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
0.40
0.05
0.25
0.35
0.40
PITCH
1.24
0.50
6X
0.30
NLSV1T34/D