GTL2002D,112 NXP Semiconductors, GTL2002D,112 Datasheet - Page 18

• Manufacturer Part Number: GTL2002D,112
• Description: IC XLATR 2BIT BI-DIREC 8SOIC
• Manufacturer: NXP Semiconductors

Specifications of GTL2002D,112

• Logic Function: Translator, Bidirectional
• Number Of Bits: 2
• Input Type: Voltage
• Output Type: Voltage
• Number Of Channels: 2
• Number Of Outputs/channel: 1
• Differential - Input:output: No/No
• Propagation Delay (max): 1.5ns
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Supply Voltage: 3 V ~ 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Rate: -
• Other names: 568-4224-5; 935268311112; GTL2002D; GTL2002D

NXP Semiconductors
GTL2002_7
Product data sheet
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 13.
Table 14.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 13
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
14
17.
Rev. 07 — 2 July 2009
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
2-bit bidirectional low voltage translator
350 to 2000
260
250
245
17) than a SnPb process, thus
220
220
350
> 2000
260
245
245
GTL2002
© NXP B.V. 2009. All rights reserved.
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