SI8472DB VISHAY [Vishay Siliconix], SI8472DB Datasheet - Page 8

• Manufacturer Part Number: SI8472DB
• Description: N-Channel 20-V (D-S) MOSFET
• Manufacturer: VISHAY [Vishay Siliconix]

Si8472DB
Vishay Siliconix
PACKAGE OUTLINE
MICRO FOOT 1 mm x 1 mm: 4-BUMP (2 x 2, 0.5 mm PITCH)
Notes (Unless otherwise specified):
1. All dimensions are in millimeters.
2. Four (4) solder bumps are lead (Pb)-free 95.5Sn/3.8Ag/0.7Cu with diameter 0.30 mm to 0.32 mm.
3. Backside surface is coated with a Ti/Ni/Ag layer.
4. Non-solder mask defined copper landing pad.
5. •is location of pin 1.
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?63300.
www.vishay.com
8
Dim.
A
A
A
D
b
e
s
1
2
0.462
0.220
0.242
0.300
0.230
0.920
Min.
Mark on Backside of Die
Recommended Land
2
1
8472
X X X
4 x Ø 0.24 to 0.26 Note 4
Solder Mask ~ Ø 0.25
Millimeters
Nom.
0.505
0.250
0.255
0.310
0.500
0.250
0.960
4
3
a
4 x Ø b
0.548
0.280
0.268
0.320
0.270
1.000
Max.
s
S
D
D
e
Bump Note 2
0.0181
0.0086
0.0095
0.0118
0.0090
0.0362
Min.
G
S
Inches
0.0198
0.0098
0.0100
0.0122
0.0197
0.0098
0.0378
Nom.
S11-1387-Rev. A, 11-Jul-11
Document Number: 63300
0.0215
0.0110
0.0105
0.0126
0.0106
0.0394
Max.