HI-1573PCIF HOLTIC [Holt Integrated Circuits], HI-1573PCIF Datasheet - Page 6

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HI-1573PCIF

Manufacturer Part Number
HI-1573PCIF
Description
3.3V Monolithic Dual Transceivers
Manufacturer
HOLTIC [Holt Integrated Circuits]
Datasheet
THERMAL CHARACTERISTICS
HEAT SINK - ESOIC & CHIP-SCALE
PACKAGE
Both the HI-1573PSI/T/M and HI-1574PSI/T/M use a 20-
pin thermally enhanced SOIC package. The HI-
1573PCI/T and HI-1574PCI/T use a plastic chip-scale
package. These packages include a metal heat sink
located on the bottom surface of the device. This heat
sink should be soldered down to the printed circuit board
for optimum thermal dissipation.
electrically isolated and may be soldered to any
convenient power or ground plane..
Data taken at VDD=3.3V, continuous transmission at 1Mbit/s, single transmitter enabled.
TXINHA/B
35
HI-1573PSI / T / M
HI-1574PSI / T / M
HI-1573CDI / T / M
HI-1574CDI / T / M
HI-1573PCI / T
HI-1574PCI / T
PART NUMBER
TXA/B
TXA/B
W
(.5 Zo)
TRANSMITTER
(.75 Zo)
(.75 Zo)
52.5
52.5
Figure 3. Transformer Coupled Test Circuits
44-pin Plastic chip-
PACKAGE STYLE
enhanced plastic
20-pin Thermally
side-brazed DIP
20-pin Ceramic
SOIC (ESOIC)
scale package
W
W
BUSA/B
BUSA/B
The heat sink is
Transformer
Coupling
HOLT INTEGRATED CIRCUITS
1.4:1
HI-1573, HI-1574
Transformer
Isolation
1:1.79
CONDITION
unsoldered
unsoldered
Point
“A ”
Heat sink
Heat sink
Socketed
Heat sink
soldered
T
Transformer
6
Isolation
APPLICATIONS NOTE
Holt Applications Note AN-500 provides circuit design
notes regarding the use of Holt's family of MIL-STD-1553
transceivers. Layout considerations, as well as
recommended interface and protection components are
included.
1.79:1
Point
“A ”
T
Transformer
Coupling
54°C/W
47°C/W
62°C/W
49°C/W
1:1.4
Ø
RXENA/B
JA
T
JUNCTION TEMPERATURE
A
RECEIVER
52°C
49°C
56°C
50°C
=25°C
(.75 Zo)
(.75 Zo)
52.5
52.5
W
W
T
112°C
109°C
116°C
110°C
A
=85°C T
35
RXA/B
RXA/B
W
(.5 Zo)
A
152°C
149°C
156°C
150°C
=125°C

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