HI-1573PCIF HOLTIC [Holt Integrated Circuits], HI-1573PCIF Datasheet

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HI-1573PCIF

Manufacturer Part Number
HI-1573PCIF
Description
3.3V Monolithic Dual Transceivers
Manufacturer
HOLTIC [Holt Integrated Circuits]
Datasheet
DESCRIPTION
The HI-1573 and HI-1574 are low power CMOS dual
transceivers designed to meet the requirements of the
MIL-STD-1553 specification.
The transmitter section of each channel takes
complementary CMOS / TTL digital input data and
converts it to bi-phase Manchester encoded 1553 signals
suitable for driving the bus isolation transformer. Separate
transmitter inhibit control signals are provided for each
transmitter.
The receiver section of the each channel converts the 1553
bus bi-phase data to complementary CMOS / TTL data
suitable for inputting to a Manchester decoder. Each
receiver has a separate enable input which can be used to
force the output of the receiver to a logic "0" (HI-1573) or
logic 1 (HI-1574).
To minimize the package size for this function, the
transmitter outputs are internally connected to the receiver
inputs, so that only two pins are required for connection to
each coupling transformer. For designs requiring
independent access to transmitter and receiver 1553
signals, please contact your Holt Sales representative.
(DS1573 Rev.I)
FEATURES
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January 2007
Compliant to MIL-STD-1553A & B,
ARINC 708A
3.3V single supply operation
Smallest footprint available in 20 pin plastic
ESOIC (thermally enhanced SOIC) package
Less than 0.5W maximum power dissipation
7 mm x 7 mm 44-pin plastic chip-scale
package
Available in DIP and small outline (ESOIC)
package options
Military processing options
Industry standard pin configurations
HOLT INTEGRATED CIRCUITS
www.holtic.com
HI-1573, HI-1574
3.3V Monolithic Dual Transceivers
PIN CONFIGURATIONS
PIN CONFIGURATIONS
20 Pin Plastic ESOIC - WB package
RXENA 4
RXENB 9
GNDA 5
GNDB 10
VDDA
BUSA 2
BUSA
VDDB 6
BUSB 7
BUSB
RXENA 2
RXENA 4
RXENB 9
20 Pin Ceramic DIP package
GNDA 3
GNDA 4
GNDA 5
VDDB 6
VDDB 7
BUSB 8
BUSB 9
BUSB
BUSB
GNDA 5
GNDB 10
44 Pin Plastic 7mm x 7mm
VDDB 6
VDDA 1
BUSA 2
BUSA
BUSB 7
BUSB
-
10
11
1
Chip-scale package
1
3
8
3
8
1573CDM
1574CDM
1573PSM
1574PSM
1573CDT
1574CDT
1573PST
1574PST
1573CDI
1574CDI
1573PSI
1574PSI
1573PCT
1574PCT
1573PCI
1574PCI
MIL-STD-1553
20
19 TXA
18 TXINHA
17 RXA
16
15
14 TXB
13 TXINHB
12 RXB
11
20
19 TXA
18 TXINHA
17 RXA
16
15
14 TXB
13 TXINHB
12 RXB
11
RXB
TXA
RXA
TXB
33 -
32 -
31 TXINHA
30 RXA
29
28 -
27 -
26
25 TXB
24 TXINHB
23 -
RXA
TXB
TXA
RXA
TXB
RXB
01/07

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HI-1573PCIF Summary of contents

Page 1

... CMOS / TTL data suitable for inputting to a Manchester decoder. Each receiver has a separate enable input which can be used to force the output of the receiver to a logic "0" (HI-1573) or logic 1 (HI-1574). To minimize the package size for this function, the ...

Page 2

... CMOS data at the RXA/B and pins. Each set of receiver outputs can be independently forced TXA The to a logic "0" (HI-1573) or logic “1” (HI-1574) by setting RXENA or RXENB low. BUSA MIL-STD-1553 BUS INTERFACE A direct coupled interface (see Figure 2) uses a 1:2 ...

Page 3

... RECEIVER RXA/B Receive Logic RXA/B Comparator RXENA/B TXA/B TXA/B BUSA/B - BUSA/B Vin (Line to Line RXA/B RXA/B HI-1573, HI-1574 BUSA/B BUSA/B Input Filter Figure 1. Block Diagram TRANSMIT WAVEFORM - EXAMPLE PATTERN RECEIVE WAVEFORMS - EXAMPLE PATTERN HOLT INTEGRATED CIRCUITS ...

Page 4

... Supply Voltage -0 +3.6 V VDD....................................... 3.3V... ±5% 10 Vp-p Temperature Range +1.0 A Industrial Screening.........-40°C to +85°C Hi-Temp Screening........-55°C to +125°C 1.0 W Military Screening..........-55°C to +125°C 7mW/°C 275°C for 10 sec. NOTE: ratings or outside recommended operating 175°C conditions may cause permanent damage to the device. These are stress ratings only. Operation -65° ...

Page 5

... OUT TEST CONDITIONS From input zero crossing to RXA/B or RXA/B Spacing between RXA/B and RXA/B pulses From RXENA/B rising or falling edge to RXA/B or RXA/B TXA/B, TXA/B to BUSA/B, BUSA/B 35 ohm load 35 ohm load Inhibited output Active output 1:2.5 BUSA/B BUSA/B Isolation Transformer 2.5 Isolation ...

Page 6

... SOIC package. The HI- 1573PCI/T and HI-1574PCI/T use a plastic chip-scale package. These packages include a metal heat sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimum thermal dissipation. electrically isolated and may be soldered to any convenient power or ground plane ...

Page 7

... PART NUMBER PART NUMBER 1573CD 1574CD RECOMMENDED TRANSFORMERS The HI-1573 and HI-1574 transceivers have been characterized for compliance with the electrical require- ments of MIL-STD-1553 when used with the following MANUFACTURER PART NUMBER Technotrol TL1553-45 Premier Magnetics PM-DB2725EX Technotrol TQ1553-2 ...

Page 8

PLASTIC SMALL OUTLINE (ESOIC (Wide Body, Thermally Enhanced) .5035 ± .0075 (12.789 ± .191) .4065 ± .0125 Top View (10.325 ± .318) .018 (.457) .050 TYP (1.27) 20-PIN CERAMIC SIDE-BRAZED DIP .050 TYP. (1.270 TYP.) .200 MAX. ...

Page 9

... PLASTIC CHIP-SCALE PACKAGE 7.00 ± .10 7.00 ± .10 0.90 ± .10 PACKAGE DIMENSIONS Heat sink stud on bottom of package. 5.65 ± .15 0.40 ± .05 0.2 typ HOLT INTEGRATED CIRCUITS 9 millimeters 5.65 ± .15 0.50 0.25 typ ...

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