RU82566DC INTEL [Intel Corporation], RU82566DC Datasheet

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RU82566DC

Manufacturer Part Number

RU82566DC

Description

82566 Gigabit Platform LAN Connect

Manufacturer

INTEL [Intel Corporation]

Datasheet

1.RU82566DC.pdf (30 pages)

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Meier Automation Equipment Co., Limited

Meier Automation Equipment Co., Limited

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RU82566DC

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INTEL

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Meier Automation Equipment Co., Limited

Meier Automation Equipment Co., Limited

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Meier Automation Equipment Co., Limited

Meier Automation Equipment Co., Limited

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RU82566DCSL97K

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INTEL

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Download datasheet (368Kb)

82566 Gigabit Platform LAN Connect

Networking Silicon

Product Features

IEEE 802.3ab compliant

Robust end to end connections over various

cable lengths

Full duplex at 10, 100, or 1000 Mbps and

half duplex at 10 or 100 Mbps.

IEEE 802.3ab Auto-negotiation with Next

Page support

10/100 downshift

Automatic MDI crossover

Advanced Cable Diagnostics

Footprint compatible with 82562V devices

for a single-board dual design (Gigabit and

10/100)

LCI interface for a very low power 10/100

link

— Robust operation over the installed base

— Automatic link configuration including

— Automatic link speed adjustment with

— Helps to correct for infrastructure issues

— Improved end-user troubleshooting

of Category-5 (Cat-5) twisted pair

cabling

speed, duplex, and flow control

poor quality cable

Gigabit LAN Connect Interface

3 LED outputs

Clock supplied to MAC

Full chip power down

81-pin, 1.0 mm pitch, 10 mm x 10 mm

FCMMAP (BGA) Package

Integrated voltage regulator and power

supply control, which can be powered from

a single 3.3V DC rail

Operating temperatures: 0° C to 70° C and

0° C to 55° C (with internal regulator) –

heat sink or forced airflow not required

Power Consumption less than 1.16 Watts

(silicon power)

— Low pin count, high speed interface

— Allows PHY placement proximity to I/O

— Link and Activity indications (10, 100,

— Cost optimized design

— Support for lowest power state

— Smaller footprint and lower power

— Simple Thermal Design

with special low power idle modes

back panel.

and 1000 Mbps)

dissipation compared to multi-chip

MAC and PHY solutions. Footprint

compatible with the Intel

Platform LAN Connect device

Datasheet

®

82562V

Revision 2.4

317436-003

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