AM29LV160 AMD [Advanced Micro Devices], AM29LV160 Datasheet - Page 8

• Manufacturer Part Number: AM29LV160
• Description: 16 Megabit (2 M x 8-Bit/1 M x 16-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory
• Manufacturer: AMD [Advanced Micro Devices]

ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combi-
nation) is formed by a combination of the elements below.
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
AM29LV160BT70R,
AM29LV160BB70R
AM29LV160BT80,
AM29LV160BB80
AM29LV160BT90,
AM29LV160BB90
AM29LV160BT120,
AM29LV160BB120
Valid Combinations For TSOP and SO Packages
AM29LV160B
Valid Combinations
T
70R
EC, FC, SC
EC, EI, EE,
FC, FI, FE,
SC, SI, SE
E
DEVICE NUMBER/DESCRIPTION
Am29LV160B
16 Megabit (2M x 8-Bit/1M x 16-Bit) CMOS Flash Memory
3.0 Volt-only Read, Program, and Erase
C
Am29LV160B
office to confirm availability of specific valid combinations and
to check on newly released combinations.
AM29LV160BT70R,
AM29LV160BB70R
AM29LV160BT80,
AM29LV160BB80
AM29LV160BT90,
AM29LV160BB90
AM29LV160BT120,
AM29LV160BB120
OPTIONAL PROCESSING
Blank = Standard Processing
(Contact an AMD representative for more information)
TEMPERATURE RANGE
C = Commercial (0°C to +70°C)
I = Industrial (–40°C to +85°C)
E = Extended (–55°C to +125°C)
PACKAGE TYPE
E
F
S
WC =
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T = Top Sector
B = Bottom Sector
B = Burn-in
=
=
=
Valid Combinations for FBGA Packages
48-Pin Thin Small Outline Package (TSOP)
Standard Pinout (TS 048)
48-Pin Thin Small Outline Package (TSOP)
Reverse Pinout (TSR048)
44-Pin Small Outline Package (SO 044)
48-ball Fine-Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 8 x 9 mm package (FBC048)
Order Number
WCC,
WCC
WCI,
WCE
L160BT70R,
L160BB70R
L160BT80V,
L160BB80V
L160BT90V,
L160BB90V
L160BT12V,
L160BB12V
Package Marking
C, I, E
C
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