AM29F010-1 Advanced Micro Devices, AM29F010-1 Datasheet - Page 7

• Manufacturer Part Number: AM29F010-1
• Description: 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only/ Uniform Sector Flash Memory-Die Revision 1
• Manufacturer: Advanced Micro Devices

PHYSICAL SPECIFICATIONS
Die dimensions . . . . . . . . . . . . . . 174 mils x 189 mils
Die Thickness . . . . . . . . . . . . . ~20 mils or ~0.51 mm
Bond Pad Size . . . . . . . . . . . . . . 4.47 mils x 4.47 mils
Pad Area Free of Passivation . . . . . . . . . .19.98 mils
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Si/Cu
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
DC OPERATING CONDITIONS
V
Junction Temperature Under Bias . .T
Operating Temperature . . . Commercial 0 C to +70 C
1/13/98
CC
(Supply Voltage) . . . . . . . . . . . . . . .4.5 V to 5.5 V
For Read-only . . . . . . . . . . .T
may be grounded (optional)
Extended –55 C to +125 C
Industrial –40 C to +85 C
113.48 m x 113.48 m
4.42 mm x 4.80 mm
J
J
(max) = 130 C
(max) = 140 C
Am29F010 Known Good Die
12,878 m
S U P P L E M E N T
2
2
MANUFACTURING INFORMATION
Manufacturing and Test. . . . . . . . . Fab 14, Austin, TX
Manufacturing ID. . . . . . . . . . . . . . . . . . . . . . 98108AK
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . CS19AFDS
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIAL HANDLING INSTRUCTIONS
Processing
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250 C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30 C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
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